AD9142 datasheet(9/65 Pages) AD

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Data Sheet

AD9142

Rev. 0 | Page 9 of 64

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

AVDD33 to AVSS, EPAD, CVSS, DVSS

−0.3 V to +3.6 V

DVDD18, CVDD18 to AVSS, EPAD,

CVSS, DVSS

−0.3 V to +2.1 V

AVSS to EPAD, CVSS, DVSS

−0.3 V to +0.3 V

EPAD to AVSS, CVSS, DVSS

−0.3 V to +0.3 V

CVSS to AVSS, EPAD, DVSS

−0.3 V to +0.3 V

DVSS to AVSS, EPAD, CVSS

−0.3 V to +0.3 V

FSADJ, REFIO, IOUT1P/IOUT1N,

IOUT2P/IOUT2N to AVSS

−0.3 V to AVDD33 + 0.3 V

D[15:0]P/D[15:0]N, FRAMEP/FRAMEN,

DCIP/DCIN to EPAD, DVSS

−0.3 V to DVDD18 + 0.3 V

DACCLKP/DACCLKN,

REFP/SYNCP/REFN/SYNCN to CVSS

−0.3 V to CVDD18 + 0.3 V

RESET, IRQ1, IRQ2, CS, SCLK, SDIO

to EPAD, DVSS

−0.3 V to DVDD18 + 0.3 V

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

THERMAL RESISTANCE

The exposed pad (EPAD) must be soldered to the ground plane

(AVSS) for the 72-lead LFCSP. The EPAD provides an electrical,

thermal, and mechanical connection to the board.

Typical θJA, θJB, and θJC values are specified for a 4-layer board in

still air. Airflow increases heat dissipation, effectively reducing

θJA and θJB.

Table 8. Thermal Resistance

Package

θJA

θJB

θJC

Unit

Conditions

72-Lead LFCSP

20.7

10.9

1.1

°C/W

EPAD soldered

to ground plane

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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