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AS260 Datasheet(PDF) 10 Page - ON Semiconductor

Part # AS260
Description  High-Definition (HD) Digital Image Sensor
PDF  45 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

AS260 Datasheet(HTML) 10 Page - ON Semiconductor

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AR0260 DS Rev. G Pub. 4/15 EN
10
©Semiconductor Components Industries, LLC,2015.
AR0260: 1/6-Inch 1080P High-Definition (HD) Digital Image Sensor
Decoupling Capacitor Recommendations
Decoupling Capacitor Recommendations
It is important to provide clean, well regulated power to each power supply. The ON
Semiconductor recommendation for capacitor placement and values are based on our
internal demo camera design and verified in hardware. Note: Because hardware design
is influenced by many factors, such as layout, operating conditions, and component
selection, the customer is ultimately responsible to ensure that clean power is provided
for their own designs.
In order of preference, ON Semiconductor recommends:
1. Mount 0.1F and 1F decoupling capacitors for each power supply as close as possi-
ble to the pad and place a 10 F capacitor nearby off-module.
2. If module limitations allow for only six decoupling capacitors for a three-regulator
design use a 0.1F and 1F capacitor for each of the three regulated supplies. ON
Semiconductor also recommends placing a 10F capacitor for each supply off-mod-
ule, but close to each supply.
3. If module limitations allow for only three decoupling capacitors, use a 1F capacitor
(preferred) or a 0.1F capacitor for each of the three regulated supplies. ON Semicon-
ductor recommends placing a 10F capacitor for each supply off-module but close to
each supply.
4. Give priority to the VAA supply for additional decoupling capacitors.
5. Inductive filtering components are not recommended.
6. Follow best practices when performing physical layout. Refer to technical note TN-
09-131.
Power-Up Sequence
Powering up the sensor requires voltages to be applied in a particular order, as seen in
Figure 3. The timing requirements are shown in Table 4. The sensor includes a power-on
reset feature that initiates a reset upon power up of the sensor.
Figure 3:
Power-Up Sequence
Table 4:
Power-Up Signal Timing
Symbol Parameter
Min
Max
Unit
t1
Delay from REG_IN0 and VDD_PHY to VDD_IO
50
200
ms
t2Delay from VDD_IO to VAA and VAA_PIX
0
50
ms
t3EXTCLK activation
0
ms
VAA, VAA_PIX
t
2
EXTCLK
t
3
REG_IN0, VDD_PHY
VDD_IO
t
1



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