R200 datasheet(27/51 Pages) INTEL

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System Integration

334616-001

3. Depth performance degradation is significant. When the load or deflection is

removed from the module a user calibration will be required to recover the

module’s depth performance.

Note: These are Intel® RealSense™ R200 module specifications. Further analysis is required

to determine the relationship between the system flex and the module flex, and as a result,

determine size of the air gap around the module in order to buffer the module from the

system.

Table 7-1. Module Bend and Twist Limits

Limit

Max Load

Deflection

Bend while functional

5 N

0 - 40 um

Bend Nonfunctional

129 N

40um - 1mm

Bend Failure (Recalibration Required)

193 N

1 - 1.5mm

Twist while functional

2.4Nmm

0.5 degrees

Twist Nonfunctional

48Nmm

0.5-1.5 degrees

Twist Failure (Recalibration Required)

96Nmm

1.5-2.0 degrees

7.3

Camera Module Dimensions

The camera module nominal dimensions, with tolerances, are in the mechanical design

package.

7.4

Camera Module Mass

The module mass is approximately 8 grams.

7.5

Grounding

Testing should be performed to quantify the level of grounding required. It is

recommended that there be at least two ground contact points to the system.

•

The thermal heat spreader and reinforcement frame can be used as primary

GND contact points to the system.

•

The openings at the system for each of the R200 components should be as

small as possible.

7.6

Motherboard Receptacle

It is recommended that the motherboard receptacle is grounded as well as ground bar

pads implemented.

R200 Datasheet(PDF) 27 Page - Intel Corporation

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