R200 datasheet(36/51 Pages) INTEL

Part #	R200

Description	Embedded Infrared Assisted Stereovision 3D Imaging System with Color Camera

PDF	51 Pages

Scroll/Zoom	100%

Manufacturer	INTEL [Intel Corporation]

Direct Link	http://www.intel.com

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36 / 51 page

System Integration

334616-001

Figure 7-14. Module Mounting Rear Cover

Table 7-5. Copper Foil Recommendation

Detail

Notes

Material

Copper

Thickness

0.2mm

Width

110mm (entire back side of module)

Min Overlap with Module

9.5mm

Table 7-6. Heat Spreader Recommendation

Detail

Notes

Material

Graphite

Thickness

0.2mm

Minimum Surface Area

260x80mm^2

Min Overlap With Copper Foil

10mm

7.10

Motherboard Routing Considerations

The imaging module requires a dedicated XHCI USB3 port. A USB hub must not be

implemented between the imaging module and XHCI USB3 port to ensure highest

possible bandwidth. The routing topology is specific to the platform. If the platform

the R200 is being integrated is not listed below, please contact your Intel

representative for support details.

Adhesive

Camera

Module

R200 Datasheet(PDF) 36 Page - Intel Corporation