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R200 Datasheet(PDF) 34 Page - Intel Corporation |
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R200 Datasheet(HTML) 34 Page - Intel Corporation |
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34 / 51 page ![]() System Integration 34 334616-001 Table 7-3. Component Case Temperature vs. Junction Temperature Point Component Junction Temp (Est.) TC1 Right IR Camera Surface Case Temp +8oC TC2 RGB Camera Surface Case Temp +9oC TC3 Left IR Camera Surface Case Temp +8oC There is a single embedded thermal sensor on the R200 module. This thermal sensor has been correlated to the Laser Projector’s junction temperature. It should not be used to correlate junction temperatures of any of the other components on the R200 module. Table 7-4. Thermal Sensor vs. Laser Projector Junction Temperature Item Component Junction Temp (Est.) Embedded Thermal Sensor Laser Projector Thermal Sensor +9 ± 3°C 7.9.2 Thermal Management The recommended strategy for thermal management is to use thin copper foil to transfer heat away from the module. The use of flexible foil maintains the isolation of the module from the system chassis as the foil will not apply mechanical loading on the module. The copper foil is adhered to the back side of the module and transfers heat to a graphite heat spreader on the system chassis rear cover or over the LCD panel heat spreader. If the LCD panel heat spreader is used, care must be taken to avoid overheating the LCD panel. It is recommended to mount the module on a thermally conductive chassis component. The thermal properties of the adhesive should be considered when choosing an adhesive to attach the camera module to the chassis. The bracket should contact metal in the chassis to dissipate heat and provide an ESD ground path. Alternatively, the copper foil can provide an ESD ground path and other non- electrically conductive adhesives can be used. While a longer bracket would help thermal performance, the bracket should be no more than 25mm long to keep the module isolated from chassis flex. |
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