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R200 Datasheet(PDF) 34 Page - Intel Corporation

Part # R200
Description  Embedded Infrared Assisted Stereovision 3D Imaging System with Color Camera
PDF  51 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

R200 Datasheet(HTML) 34 Page - Intel Corporation

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System Integration
34
334616-001
Table 7-3. Component Case Temperature vs. Junction Temperature
Point
Component
Junction Temp (Est.)
TC1
Right IR Camera Surface
Case Temp +8oC
TC2
RGB Camera Surface
Case Temp +9oC
TC3
Left IR Camera Surface
Case Temp +8oC
There is a single embedded thermal sensor on the R200 module. This thermal sensor
has been correlated to the Laser Projector’s junction temperature. It should not be
used to correlate junction temperatures of any of the other components on the R200
module.
Table 7-4. Thermal Sensor vs. Laser Projector Junction Temperature
Item
Component
Junction Temp (Est.)
Embedded Thermal Sensor
Laser Projector
Thermal Sensor +9 ± 3°C
7.9.2
Thermal Management
The recommended strategy for thermal management is to use thin copper foil to
transfer heat away from the module. The use of flexible foil maintains the isolation of
the module from the system chassis as the foil will not apply mechanical loading on
the module. The copper foil is adhered to the back side of the module and transfers
heat to a graphite heat spreader on the system chassis rear cover or over the LCD
panel heat spreader. If the LCD panel heat spreader is used, care must be taken to
avoid overheating the LCD panel.
It is recommended to mount the module on a thermally conductive chassis
component. The thermal properties of the adhesive should be considered when
choosing an adhesive to attach the camera module to the chassis. The bracket should
contact metal in the chassis to dissipate heat and provide an ESD ground path.
Alternatively, the copper foil can provide an ESD ground path and other non-
electrically conductive adhesives can be used. While a longer bracket would help
thermal performance, the bracket should be no more than 25mm long to keep the
module isolated from chassis flex.



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