AD9082 datasheet(15/33 Pages) AD

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Data Sheet

AD9082

Rev. A | Page 15 of 33

ABSOLUTE MAXIMUM RATINGS

Table 12.

Parameter

Rating

ISET, DACxP, DACxN, TDP, TDN

−0.3 V to AVDD2 + 0.3 V

VCO_COARSE, VCO_FINE,

VCO_VCM, VCO_VREG

−0.3 V to AVDD2_PLL + 0.3 V

ADC0P, ADC0N, ADC1P, ADC1N

−0.3 V to BVDD2 + 0.3 V

VCM0, VCM1

−0.3 V to RVDD2 + 0.3 V

CLKINP, CLKINN

−0.2 V to PLLCLKVDD1 + 0.2 V

ADCDRVN, ADCDRVP

−0.2 V to CLKVDD1 + 0.2 V

SERDINx±, SERDOUTx±

−0.2 V to SVDD1 + 0.2 V

SYSREFP, SYSREFN, and

SYNCxINB±

−0.2 V to +2.5 V

SYNCxOUTB±, SYNCxINB±,

RESETB, TXENx, RXENx, IRQB_x,

CSB, SCLK, SDIO, SDO,

TMU_REFN, TMU_REFP,

ADCx_SMON0, ADCx_SMON1,

ADCx_FD0, ADCx_FD1, GPIOx

−0.3 V to DVDD1P8 + 0.3 V

AVDD2, AVDD2_PLL, BVDD2,

RVDD2, SVDD2_PLL, DVDD1P8

−0.3 V to +2.2 V

PLLCLKVDD1, AVDD1,

AVDD1_ADC, CLKVDD1,

FVDD1, DAVDD1, DVDD1_RT,

DCLKVDD1, SVDD1

−0.2 V to +1.2 V

VNN1

−1.1 V to +0.2 V

Temperature

Junction (TJ)1

125°C

Storage Range

−40°C to +150°C

Do not exceed this temperature for any duration of time when the device is

powered.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

REFLOW PROFILE

The AD9082 reflow profile is in accordance with the JEDEC

JESD 20 criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. The use of appropriate thermal

management techniques is recommended to ensure that the

maximum TJ does not exceed the limits shown in Table 12.

θJA is the natural convection, junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC_TOP is the junction to case, thermal resistance.

θJB is the junction to board, thermal resistance.

Table 13. Simulated Thermal Resistance1

PCB Type

Airflow Velocity

(m/sec)

θJA

θJC_TOP

θJB

Unit

JEDEC 2s2p

Board

0.0

14.9

0.70

1.8

°C/W

Thermal resistance values specified are simulated based on JEDEC specifications

in compliance with JESD51-12 with the device power equal to 9 W.

ESD CAUTION

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