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SC3200 Datasheet(PDF) 376 Page - Advanced Micro Devices

Part # SC3200
Description  AMD GEODE-TM SC3200 PROCESSOR
PDF  447 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

SC3200 Datasheet(HTML) 376 Page - Advanced Micro Devices

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376
AMD Geode™ SC3200 Processor Data Book
Electrical Specifications
Revision 5.1
9.2.1
INAB DC Characteristics
9.2.2
INBTN DC Characteristics
9.2.3
INPCI DC Characteristics
Note that the buffer type for PCICLK (EBGA ball E2 / TEPBGA ball A7) is INT - not INPCI.
Symbol
Parameter
Min
Max
Unit
Comments
VIH
Input High Voltage
1.4
V
VIL
Input Low Voltage
-0.5
(Note 1)
0.8
V
IIL
Input Leakage Current
10
µA
VIN = VIO
-10
µA
VIN = VSS
VHIS
Input hysteresis
150
mV
Note 1. Not 100% tested.
Symbol
Parameter
Min
Max
Unit
Comments
VIH
Input High Voltage
2.0
VSB+0.3
(Note 1)
V
VIL
Input Low Voltage
-0.5
(Note 1)
0.8
V
IIL
Input Leakage Current
5
µA
VIN = VSB
-36
µA
VIN = VSS
VHIS
Input HysteresisNote 1
250
mV
Note 1. Not 100% tested.
Symbol
Parameter
Min
Max
Unit
Comments
VIH
Input High Voltage
0.5VIO
VIO+0.3
(Note 1)
Note 1. Not 100% tested.
V
VIL
Input Low Voltage
-0.5
(Note 1)
0.3VIO
V
VIPU
Input Pull-up Voltage
0.7VIO
V
Note 2
Note 2. Not 100% tested. This parameter indicates the minimum voltage to which pull-up resistors are calculated in order
to pull a floated network.
lIL
Input Leakage Current
+/-10
µA
0 < VIN < VIO, Note 3, Note 4
Note 3. Input leakage currents include HiZ output leakage for all bidirectional buffers with TRI-STATE outputs.
Note 4. See Exceptions 2 and 3 in Section 9.2.15.1 on page 379.



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