SPC584BX datasheet(16/142 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC584Bx

16/142

DS11701 Rev 4

TSTG

Maximum non-

operating

Storage

temperature

range

—

–55

—

125

°C

TPAS

Maximum

nonoperating

temperature

during passive

lifetime

—–55

—

150(7)

°C

TSTORAGE

—

Maximum

storage time,

assembled part

programmed in

ECU

No supply; storage

temperature in

range –40 °C to

60 °C

—

years

TSDR

Maximum solder

temperature Pb-

free packaged(8)

——

—

260

°C

MSL

Moisture

sensitivity

level(9)

——

—

TXRAY dose

Maximum

cumulated

XRAY dose

Typical range for

X-rays source

during

inspection:80 ÷

130 KV; 20 ÷

A

——

grey

1. VDD_LV: allowed 1.335 V - 1.400 V for 60 seconds cumulative time at the given temperature profile. Remaining time allowed

1.260 V - 1.335 V for 10 hours cumulative time at the given temperature profile. Remaining time as defined in Section 4.3:

Operating conditions.

2. VDD_HV: allowed 5.5 V – 6.0 V for 60 seconds cumulative time at the given temperature profile, for 10 hours cumulative

time with the device in reset at the given temperature profile. Remaining time as defined in Section 4.3: Operating

conditions.

3. The maximum input voltage on an I/O pin tracks with the associated I/O supply maximum. For the injection current

condition on a pin, the voltage will be equal to the supply plus the voltage drop across the internal ESD diode from I/O pin

to supply. The diode voltage varies greatly across process and temperature, but a value of 0.3 V can be used for nominal

calculations.

4. Relative value can be exceeded if design measures are taken to ensure injection current limitation (parameter IINJ).

5. This limitation applies to pads with digital input buffer enabled. If the digital input buffer is disabled, there are no maximum

limits to the transition time.

6. The limits for the sum of all normal and injected currents on all pads within the same supply segment can be found in

Section 4.8.3: I/O pad current specifications.

7. 175 °C are allowed for limited time. Mission profile with passive lifetime temperature >150 °C have to be evaluated by ST to

confirm that are granted by product qualification.

8. Solder profile per IPC/JEDEC J-STD-020D.

9. Moisture sensitivity per JDEC test method A112.

Table 4. Absolute maximum ratings (continued)

Symbol

Parameter

Conditions

Value

Unit

Min

Typ

Max

SPC584BX Datasheet(PDF) 16 Page - STMicroelectronics

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