SPC584BX datasheet(24/142 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC584Bx

24/142

DS11701 Rev 4

IDDSTBY32

Total standby mode

current on VDD_LV and

VDD_HV supply, 32 KB

RAM(10)

TJ = 25 °C

—

130

µA

CTJ = 40 °C

—

200

DTJ = 55 °C

—

300

DTJ = 120 °C

—

1.8

PTJ = 150 °C

—

4.1

IDDSTBY128

Total standby mode

current on VDD_LV and

VDD_HV supply,

128 KB RAM(10)

TJ = 25 °C

—

160

µA

CTJ = 40 °C

—

250

µA

DTJ = 55 °C

—

370

µA

DTJ = 120 °C

—

1.2

2.2

PTJ = 150 °C

—

2.8

5.0

IDDSSWU1

SSWU running over all

STANDBY period with

OPC/TU commands

execution and keeping

ADC off(11)

TJ =40°C

—

1.0

3.5

IDDSSWU2

SSWU running over all

STANDBY period with

OPC/TU/ADC

commands execution

and keeping ADC

on(12)

TJ =40°C

—

3.5

5.0

1. The ranges in this table are design targets and actual data may vary in the given range.

2. The leakage considered is the sum of core logic and RAM memories. The contribution of analog modules is not considered,

and they are computed in the dynamic IDD_LV and IDD_HV parameters.

3. IDD_LKG (leakage current) and IDD_LV (dynamic current) are reported as separate parameters, to give an indication of the

consumption contributors. The tests used in validation, characterization and production are verifying that the total

consumption (leakage+dynamic) is lower or equal to the sum of the maximum values provided (IDD_LKG +IDD_LV). The two

parameters, measured separately, may exceed the maximum reported for each, depending on the operative conditions and

the software profile used.

4. Use case: 1 x e200Z4 @120 MHz, HSM @60 MHz, all IPs clock enabled, Flash access with prefetch disabled, Flash

consumption includes parallel read and program/erase, all SARADC in continuous conversion, DMA continuously triggered

by ADC conversion, 2 DSPI / 8 CAN / 2 LINFlex transmitting, RTC and STM running, 1 x EMIOS running (4 channels in

OPWMT mode), FIRC, SIRC, FXOSC, PLL0-1 running. The switching activity estimated for dynamic consumption does not

include I/O toggling, which is highly dependent on the application. Details of the software configuration are available

separately. The total device consumption is IDD_LV + IDD_HV + IDD_LKG for the selected temperature.

5. Gateway use case: One core running at 120 MHz, HSM 40 MHz, DMA, PLL, FLASH read only 25%, 8xCAN, 1xSARADC.

6. BCM use case: One Core running at 80 MHz, HSM 40 MHz, DMA, PLL, FLASH read only 25%, 1xCAN, 3xSARADC.

7. Dynamic consumption of the HSM module, including the dedicated memories, during the execution of Electronic Code

Book crypto algorithm on 1 block of 16 byte of shared RAM.

8. Flash in Low Power. Sysclk at 120 MHz, HSM 60 MHz, PLL0_PHI at 400 MHz, XTAL at 40 MHz, FIRC 16 MHz ON,

RCOSC1M off. FlexCAN: instances: 0, 1, 2, 3, 4, 5, 6, 7 ON (configured but no reception or transmission), Ethernet ON

(configured but no reception or transmission), ADC ON (continuously converting). All others IPs clock-gated.

9. Sysclk = RC16 MHz, RC16 MHz ON, RC1 MHz ON, PLL OFF. All possible peripherals off and clock gated. Flash in power

down mode.

10. STANDBY mode: device configured for minimum consumption, RC16 MHz off, RC1 MHz on.

Table 8. Device consumption (continued)

Symbol

Parameter

Conditions

Value(1)

Unit

Min

Typ

Max

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