| Electronic Components Datasheet Search |
|
RF112 Datasheet(PDF) 40 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
RF112 Datasheet(HTML) 40 Page - NXP Semiconductors |
|
40 / 45 page ![]() Table 13. Package specification (continued) Parameter Conditions Minimum Typical Maximum Unit Junction to ambient for a device soldered in a 4- layer 2S2P circuit board with large ground plane. No forced air flow. 25 K/W This figure shows the mechanical dimensions and bottom surface nomenclature of the chip. Package information RF112 Transceiver Data Sheet, Rev. 1 Draft B, 05/2024 40 NXP Semiconductors |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |