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RF112 Datasheet(PDF) 14 Page - NXP Semiconductors |
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RF112 Datasheet(HTML) 14 Page - NXP Semiconductors |
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14 / 45 page ![]() Table 3. Recommended operating conditions (continued) Characteristic Symbol Min Typ Max Unit Notes Input external clock differential input voltage level LVDS_160M_IO_P/N Input 200 400 mVpp 1 Input external clock input common mode voltage level LVDS_160M_IO_P/N Input 0.2 1.2 V 1 Input external clock duty cycle LVDS_160M_IO_P/N Input 45 50 55 % 1 Output reference clock output load LVDS_160M_IO_P/N output 100 Ω 1 Rx BB external output load (kick -back filter) R1 50 Ω 3 C1 10 pF 3 TX BB input common mode 0.5 V TX BB input signal level Full scale from DAC 0.35 Vp Frequency Range HB Lowest 4900 MHz HB Highest 6000 MHz LB Lowest 2400 MHz LB Highest 2500 MHz 3.1.3 Power Sequencing Power rails can ramp simultaneously for all voltages, Core power suppliesVDD_DIG_CORE (0.9V ) should not begin to ramp before other supplies, and should reach 90% of nominal voltage no more than 5ms after I/O rails ramp as shown in the figure below. Analog 1.67 V supply and I/O 1.8 V supply are expected to begin ramp simultaneously. Electrical characteristics RF112 Transceiver Data Sheet, Rev. 1 Draft B, 05/2024 14 NXP Semiconductors |
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