STAC9767 datasheet(92/97 Pages) IDT

92 / 97 page

STAC9766/9767

TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING

PC AUDIO

IDT™

STAC9766/9767

V 7.4 12/06

TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING

15.SOLDER REFLOW PROFILE

15.1. Standard Reflow Profile Data

Note: These devices can be hand soldered at 360

oC for 3 to 5 seconds.

FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount

Devices” (www.jedec.org/download).

Figure 26. Solder Reflow Profile

Profile Feature

Pb Free Assembly

Average Ramp-Up Rate (Tsmax - Tp)

oC / second max

Preheat

Temperature Min (Tsmin)

Temperature Max

(Tsmax)

Time (tsmin - tsmax)

150 oC

200 oC

60 - 180 seconds

Time maintained above

Temperature (T

Time (t

217 oC

60 - 150 seconds

Peak / Classification Temperature (Tp)

See “Package Classification Reflow Temperatures”

on page 93.

Time within 5 oC of actual Peak Temperature (tp)

20 - 40 seconds

Ramp-Down rate

6 oC / second max

Time 25

oC to Peak Temperature

8 minutes max

Note: All temperatures refer to topside of the package, measured on the package body surface.

STAC9767 Datasheet(PDF) 92 Page - Integrated Device Technology

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