TLV7031 datasheet(30/69 Pages) TI2

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7.4 Layout

7.4.1 Layout Guidelines

To reduce PCB fabrication cost and improve reliability, TI recommends using a 4-mil via at the center pad

connected to the ground trace or plane on the bottom layer.

TI recommends a power-supply bypass capacitor of 100nF when supply output impedance is high, supply traces

are long, or when excessive noise is expected on the supply lines. Bypass capacitors are also recommended

when the comparator output drives a long trace or is required to drive a capacitive load. Due to the fast rising

and falling edge rates and high-output sink and source capability of the TLV703x and TLV704x output stages,

higher than normal quiescent current can be drawn from the power supply. Under this circumstance, the system

will benefit from a bypass capacitor directly from the supply pin to ground.

7.4.2 Layout Example

Figure 7-13. Layout Example

The application report Designing and Manufacturing With TI's X2SON Packages (SCEA055) helps PCB

designers to achieve optimal designs.

TLV7031, TLV7032, TLV7041, TLV7042, TLV7034, TLV7044

SLVSE13J – SEPTEMBER 2017 – REVISED NOVEMBER 2024

www.ti.com

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TLV7031 Datasheet(PDF) 30 Page - Texas Instruments