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TLV7031 Datasheet(PDF) 31 Page - Texas Instruments |
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TLV7031 Datasheet(HTML) 31 Page - Texas Instruments |
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31 / 69 page ![]() 8 Device and Documentation Support 8.1 Device Support 8.1.1 Development Support 8.1.1.1 Evaluation Module An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV70x1 device family. The TLV7011 Micro-Power Comparator Dip Adaptor Evaluation Module can be requested at the Texas Instruments website through the product folder or purchased directly from the TI eStore. 8.2 Documentation Support 8.2.1 Related Documentation For related documentation, see the following: • Designing and Manufacturing With TI's X2SON Packages (SCEA055) • Low Power Comparator for Signal Processing and Wake-Up Circuit in Smart Meters (SNVA808) 8.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 8.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 8.5 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 8.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 9 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (June 2024) to Revision J (November 2024) Page • Updated "S" and "L" text and supply votlage......................................................................................................1 • Added 1.2V Recommended Min Supply for "S" and "L" devices........................................................................6 Changes from Revision H (July 2021) to Revision I (June 2024) Page • Added package variants TLV70x1L and TLV70xS............................................................................................. 1 www.ti.com TLV7031, TLV7032, TLV7041, TLV7042, TLV7034, TLV7044 SLVSE13J – SEPTEMBER 2017 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: TLV7031 TLV7032 TLV7041 TLV7042 TLV7034 TLV7044 |
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