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RZ/G3S Datasheet(PDF) 1 Page - Renesas Technology Corp |
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RZ/G3S Datasheet(HTML) 1 Page - Renesas Technology Corp |
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1 / 88 page ![]() R01DS0489EJ0120 Rev.1.20 Page 1 of 88 May 29, 2026 DATASHEET Features This LSI has following features. CPU ● Arm® Cortex®-A55, single-core Max. operating frequency: 1.1 GHz ● Arm® Cortex®-M33 core × 2 Max. operating frequency: 250 MHz One core supports Floating Extension Boot ● Selectable boot CPU from Arm® Cortex®-M33 or Arm® Cortex®- A55 On-chip SRAM and external memory interfaces ● On-chip shared SRAM (1-Mbyte on-chip SRAM with ECC) ● External DDR memory interface 1-channel memory controller for DDR4-1600 or LPDDR4-1600 with a 16-bit bus width ● eXpanded Serial Peripheral Interface (xSPI) × 1 channel ● Octa memory controller × 1 channel OctaFlash™ and OctaRAM™ are supported ● SD card host interface × 3 channels ● Multimedia card interface × 1 channel (Shared with SDHI) Various communication/storage/network interfaces ● USB 2.0 × 2 channels (Host only 1 channel/Host-Function 1 channel) ● PCI Express Gen2 (1-lane, Root Complex only) [option] ● Gigabit Ethernet controller × 2 channels ● CANFD interface × 2 channels ● I2C bus interface × 4 channels ● I3C bus interface × 1 channel ● Serial communication interface (SCI) × 2 channels ● Serial communication interface with FIFO (SCIF) × 6 channels ● Serial Peripheral Interface (RSPI) × 5 channels Extended-function timers ● General PWM timer 32-bit × 8 channels ● Multi-Function Timer Pulse Unit 32-bit × 1 channel, 16-bit × 8 channels ● Realtime clock (RTC) × 1 channel Audio ● Serial sound interface × 4 channels ● Pulse Density Modulated (PDM) interface × 3 channels ● SPDIF × 1 channel Analog/Digital converter (ADC) and sensor ● 12-bit A/D converter × 8 channels ● Thermal Sensor Unit × 1 channel Security ● Hardware cryptographic engine [option] ● On-The-Fly Decryption/Encryption (OTFDE) for external memory (DDR, xSPI, Octa) RZ/G3S Group RZ 32 & 64-bit MPUs, RZ/G Series R01DS0489EJ0120 Rev.1.20 May 29, 2026 |
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