AD9148BBCZ datasheet(8/73 Pages) AD

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AD9148

Preliminary Technical Data

Rev. PrA | Page 8 of 73

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

With

Respect To

Rating

AVDD33, IOVDD

AGND,

DGND,

CGND

−0.3 V to +3.6 V

DVDD18, CVDD18

AGND,

DGND,

CGND

−0.3 V to +2.10 V

AGND

DGND,

CGND

−0.3 V to +0.3 V

DGND

AGND,

CGND

−0.3 V to +0.3 V

CGND

AGND,

DGND

−0.3 V to +0.3 V

I120, VREF

AGND

−0.3 V to AVDD33 + 0.3 V

OUT1_P, OUT1_N,

OUT2_P, OUT2_N,

OUT3_P, OUT3_N,

OUT4_P, OUT4_N

AGND

−1.0 V to AVDD33 + 0.3 V

A15_P to A0_P,

A15_N to A0_N,

B15_P to B0_P,

B15_N, B0_N

DGND

−0.3 V to DVDD18 + 0.3 V

DCIA_P, DCIA_N,

FRAMEA_P, FRAMEA_N,

DCIB_P, DCIB_N,

FRAMEB_P, FRAMEB_N

DGND

−0.3 V to DVDD18+ 0.3 V

CLK_P, CLK_N,

REFCLK_P, REFCLK_N

CGND

−0.3 V to CVDD18 + 0.3

CSB, SCLK, SDIO, SDO,

TDO, TDI, TCK, TMS,

RESETE, IRQE, PLL_LOCK

DGND

−0.3 V to IOVDD + 0.3 V

Junction Temperature

125°C

Storage Temperature

Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Typical θJA, θJB, and θJC are specified vs. the number of PCB layers in

still air for each package offering Airflow increases heat dissipation

effectively reducing θJA and θJB.

Table 7. Thermal Resistance

Package Type

θJA

θJB

θJC

Unit

Notes

196-Ball CSP_BGA

24.7

12.6

5.7

°C/W

4-layer board,

25 PCB vias

19.2

10.9

5.3

°C/W

8-layer board,

25 PCB vias

18.1

10.5

5.3

°C/W

10-layer board,

25 PCB vias

18.0

10.5

5.3

°C/W

12-layer board,

25 PCB vias

196-Ball BGA_EP

20.9

8.6

3.1

°C/W

4-layer board,

25 PCB vias

16.2

7.7

3.1

°C/W

8-layer board,

25 PCB vias

15.2

7.4

3.1

°C/W

10-layer board,

25 PCB vias

15.0

7.4

3.1

°C/W

12-layer board,

25 PCB vias

MAXIMUM SAFE POWER DISSIPATION

The maximum junction temperature for the AD9148 is 125°C.

With the thermal resistance of the molded package (CSP_BGA)

given for a 12 layer board, the maximum power that can be

dissipated in this package can be calculated as

(

) (

)

Power

MAX

125

−

To increase the maximum power, the AD9148 is available in a

second package option (BGA_EP) which includes a heat spreader

on top of the package. Also, an external heat sink can be

attached to the top of the AD9148 CSP_BGA package. The

adjusted maximum power for each of these conditions is shown in

Table 8.

With the thermal resistance of the heat spreader package

(BGA_EP) given for a 12 layer board, the maximum power that

can be dissipated in this package can be calculated as

(

) (

)

Power

MAX

125

−

To increase the maximum power, an external heat sink can be

attached to the top of the AD9148 BGA_EP package. The

adjusted maximum power for an external heat sink is shown in

Table 8.

To aid in the selection of package, the maximum fDAC rate for a given

power dissipation over several operating conditions is shown in

Table 9. The maximum fDACrate applies to all interpolation rates.

Note that if the programmable inverse sinc filter is enabled the

maximum fDAC rate specified in Table 9 decreases.

ESD CAUTION

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