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DAC5688 Datasheet(PDF) 4 Page - Texas Instruments

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Part # DAC5688
Description  DUAL-CHANNEL, 16-BIT, 800 MSPS, 2x-8x INTERPOLATING DIGITAL-TO-ANALOG CONVERTER (DAC)
PDF  55 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

DAC5688 Datasheet(HTML) 4 Page - Texas Instruments

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DAC5688
SLLS880B – DECEMBER 2007 – REVISED MAY 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Supply Voltage Range
DVDD(2)
–0.5 to 2.3
V
VFUSE(2)
–0.5 to 2.3
V
CLKVDD(2)
–0.5 to 2.3
V
AVDD(2)
–0.5 to 4
V
IOVDD(2)
–0.5 to 4
V
Supply Voltage Range
AVDD to DVDD
–2 to 2.6
V
CLKVDD to DVDD
–0.5 to 0.5
V
IOVDD to AVDD
–0.5 to 0.5
V
CLK2, CLK2C(2)
–0.5 to CLKVDD + 0.5
V
CLKO_CLK1, LOCK_CLK1C, SLEEP, TXENABLE(2)
–0.5 to IOVDD + 0.5
V
DA[15..0] ,DB[15..0] (2)
–0.5 to IOVDD + 0.5
V
SDO, SDIO, SCLK, SDENB, RESETB (2)
–0.5 to IOVDD + 0.5
V
IOUTA1/B1, IOUTA2/B2 (2)
–0.5 to AVDD + 0.5
V
LPF, EXTIO, EXTLO, BIASJ (2)
–0.5 to AVDD + 0.5
V
Peak input current (any input)
20 mA
mA
Peak total input current (all inputs)
–30 mA
mA
Operating free-air temperature range, TA: DAC5688I
–40 to 85
°C
Storage temperature range
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Measured with respect to GND.
THERMAL INFORMATION
DAC5688
THERMAL CONDUCTIVITY
UNITS
64ld QFN
TJ
Maximum junction temperature (1)(2)
125
°C
qJA
Theta junction-to-ambient thermal resistance (still air)
22
Theta junction-to-ambient thermal resistance (200 lfm)
15
°C/W
yJT
Psi junction-to-top of package characterization parameter
0.2
qJB
Theta junction-to-board characterization parameter
3.5
(1)
Air flow or heat sinking reduces qJA and may be required for sustained operation at 85°C under maximum operating conditions.
(2)
It is strongly recommended to solder the device thermal pad to the board ground plane.
4
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Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): DAC5688



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