ADS4225 datasheet(3/104 Pages) TI1

3 / 104 page

ADS4222, ADS4225, ADS4226

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SBAS533C

– MARCH 2011 – REVISED JUNE 2011

ABSOLUTE MAXIMUM RATINGS

(1)

ADS424x/422x

MIN

MAX

UNIT

Supply voltage range, AVDD

–0.3

2.1

Supply voltage range, DRVDD

–0.3

2.1

Voltage between AGND and DRGND

–0.3

0.3

Voltage between AVDD to DRVDD (when AVDD leads DRVDD)

–2.4

2.4

Voltage between DRVDD to AVDD (when DRVDD leads AVDD)

–2.4

2.4

Minimum

INP_A, INM_A, INP_B, INM_B

–0.3

(1.9, AVDD + 0.3)

Voltage applied to input pins

CLKP, CLKM(2)

–0.3

AVDD + 0.3

RESET, SCLK, SDATA, SEN,

–0.3

3.9

CTRL1, CTRL2, CTRL3

Operating free-air temperature range, TA

–40

+85

°C

Operating junction temperature range, TJ

+125

°C

Storage temperature range, Tstg

–65

+150

°C

ESD rating

Human body model (HBM)

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is less than |0.3V|).

This configuration prevents the ESD protection diodes at the clock input pins from turning on.

THERMAL INFORMATION

ADS42xx

THERMAL METRIC(1)

RGC

UNITS

64 PINS

θJA

Junction-to-ambient thermal resistance

23.9

θJCtop

Junction-to-case (top) thermal resistance

10.9

θJB

Junction-to-board thermal resistance

4.3

°C/W

ψJT

Junction-to-top characterization parameter

0.1

ψJB

Junction-to-board characterization parameter

4.4

θJCbot

Junction-to-case (bottom) thermal resistance

0.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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