TLK105 datasheet(74/99 Pages) TI

74 / 99 page

TLK105

TLK106

SLLSEB8A – AUGUST 2012 – REVISED MARCH 2013

www.ti.com

Electrical Specifications

All parameters are derived by test, statistical analysis, or design.

9.1

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

VDD33_IO, AVDD33

Supply voltage

–0.3 to 3.8

PFBIN1, PFBIN2

–0.3 to 1.8

DC Input voltage

–0.3 to 3.8

TD-, TD+, RD-, RD+

–0.3 to 6

Other Inputs

–0.3 to 3.8

DC Output voltage

–0.3 to 3.8

Other outputs

–0.3 to 3.8

Maximum die temperature

125

°C

Human-Body

All pins(2)

±4

Model

Ethernet network pins (TD+, TD-, RD+, RD-)(3)

±16

ESD

Charged-Device

All pins(4)

±750

Model

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Tested in accordance to JEDEC Standard 22, Test Method A114.

(3)

Test method based upon JEDEC Standard 22 Test Method A114, Ethernet network pins (TD+, TD-, RD+, RD-) pins stressed with

respect to GND.

(4)

Tested in accordance to JEDEC Standard 22, Test Method C101.

9.2

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

VDD33_IO, AVDD33 I/O and Analog 3.3V Supply

3.0

3.3

3.6

PFBIN1, PFBIN2

Core Supply voltage

1.47

1.55

1.62

Ambient

TLK105

–40

°C

temperature(1)

TLK106

–40

105

Power dissipation(2)

270

(1)

Provided that DOWN_PAD, pin 33, is soldered down. See Thermal Vias Recommendation for more detail.

(2)

For 100Base-TX, When internal 1.55V is used. Device is operated from single 3.3V supply only.

9.3

THERMAL CHARACTERISTICS

9.3.1

TLK105 32-Pin Industrial Device (85°C) Thermal Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

θJA

Junction-to-ambient thermal resistance (no airflow)

JEDEC high-K model

36.4

θJB

Junction-to-board thermal resistance

9.3

°C/W

θJC(Top)

Junction-to-case thermal resistance, Top

26.8

θJC(Bottom)

Junction-to-case thermal resistance, Bottom

1.7

9.3.2

TLK106 32-Pin Extended Temperature (105°C) Device Thermal Characteristics

Electrical Specifications

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