DAC3151 datasheet(14/57 Pages) TI

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DAC3151

DAC3161

DAC3171

SLAS959A – AUGUST 2013 – REVISED AUGUST 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

VDDA33 to GND

–0.5 to 4

VDDA18 to GND

–0.5 to 2.3

Supply voltage

CLKVDD18 to GND

–0.5 to 2.3

IOVDD to GND

–0.5 to 4

DIGVDD18 to GND

–0.5 to 2.3

CLKVDD18 to DIGVDD18

–0.5 to 0.5

VDDA18 to DIGVDD18

–0.5 to 0.5

DA[6..0]P, DA[6..0]N, D[13..0]P, D[13..0]N, DATACLKP, DATACLKN,

–0.5 to DIGVDD18 + 0.5

DA_CLKP, DA_CLKPN, SYNCP, SYNCN to GND

Terminal voltage

range

DACCLKP, DACCLKN, ALIGNP, ALIGNN

–0.5 to CLKVDD18 + 0.5

TXENABLE, ALARM, SDO, SDIO, SCLK, SDENB, RESETB to GND

–0.5 to IOVDD + 0.5

IOUTAP, IOUTAN to GND

–0.7 to 1.4

EXTIO, BIASJ to GND

–0.5 to VDDA33 + 0.5

Storage temperature range

–65 to 150

°C

ESD, Human Body Model

THERMAL INFORMATION

DAC3151, DAC3161,

DAC3171

THERMAL METRIC(1)

UNITS

QFN (64 PIN)

θJA

Junction-to-ambient thermal resistance

23.0

θJCtop

Junction-to-case (top) thermal resistance

7.6

θJB

Junction-to-board thermal resistance

2.8

°C/W

ψJT

Junction-to-top characterization parameter

0.1

ψJB

Junction-to-board characterization parameter

2.8

θJCbot

Junction-to-case (bottom) thermal resistance

0.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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