AD9775 datasheet(9/56 Pages) AD

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AD9775

Rev. E | Page 9 of 56

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

With Respect To

Rating

AVDD, DVDD, CLKVDD

AGND, DGND, CLKGND

−0.3 V to +4.0 V

AVDD, DVDD, CLKVDD

−4.0 V to +4.0 V

AGND, DGND, CLKGND

−0.3 V to +0.3 V

REFIO, FSADJ1/FSADJ2

AGND

−0.3 V to AVDD + 0.3 V

IOUTA, IOUTB

AGND

−1.0 V to AVDD + 0.3 V

P1B13 to P1B0, P2B13 to P2B0, RESET

DGND

−0.3 V to DVDD + 0.3 V

DATACLK, PLL_LOCK

DGND

−0.3 V to DVDD + 0.3 V

CLK+, CLK–

CLKGND

−0.3 V to CLKVDD + 0.3 V

LPF

CLKGND

−0.3 V to CLKVDD + 0.3 V

SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO

DGND

−0.3 V to DVDD + 0.3 V

Junction Temperature

125°C

Storage Temperature

−65°C to +150°C

Lead Temperature (10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 8. Thermal Resistance

Package Type

θJA

Unit

80-Lead Thin Quad Flat Package

(TQFP_EP), Exposed Pad

23.5

°C/W

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