LC87FBG08A

No.A2046-13/30

Absolute Maximum Ratings

at Ta = 25

°C, VSS1 =0V

Parameter

Symbol

Pin/Remarks

Conditions

Specification

VDD[V]

min

typ

max

unit

Maximum supply

voltage

VDD max

VDD1

-0.3

+6.5

V

Input voltage

VI

CF1

-0.3

VDD+0.3

Input/output

voltage

VIO

Ports 0, 1, 2,

P70, CF2, RES

-0.3

VDD+0.3

Peak output

current

IOPH

Ports 0, 1, 2

CMOS output select

Per 1 applicable pin

-10

mA

Mean output

current

(Note 1-1)

IOMH

Ports 0, 1, 2

CMOS output select

Per 1 applicable pin

-7.5

Total output

current

ΣIOAH(1)

Ports 0, 1, 2

Total of all applicable pins

-25

Peak output

current

IOPL(1)

P02 to P07

Ports 1, 2

Per 1 applicable pin

20

IOPL(2)

P00, P01

Per 1 applicable pin

30

IOPL(3)

P70, CF2

Per 1 applicable pin

10

Mean output

current

(Note 1-1)

IOML(1)

P02 to P07

Ports 1, 2

Per 1 applicable pin

15

IOML(2)

P00, P01

Per 1 applicable pin

20

IOML(3)

P70, CF2

Per 1 applicable pin

7.5

Total output

current

ΣIOAL(1)

Ports 0, 1,

Ports 2, 7, CF2

Total of all applicable pins

70

Power

dissipation

Pd max(1)

SSOP24(225mil)

Ta=-40 to +85

°C

Package only

111

mW

Pd max(2)

Ta=-40 to +85

°C

Package with thermal

resistance board

(Note 1-2)

334

Pd max(3)

VCT24(3

× 3)

Ta=-40 to +85

°C

Package only

66

Pd max(4)

Ta=-40 to +85

°C

Package with thermal

resistance board

(Note 1-3)

335

Operating ambient

temperature

Topr

-40

+85

°C

Storage ambient

temperature

Tstg

-55

+125

Note 1-1: The mean output current is a mean value measured over 100ms.

Note 1-2: SEMI standards thermal resistance board (size: 76.1

×114.3×1.6tmm, glass epoxy) is used.

Note 1-3: Thermal resistance board (size: 40

×50×0.8tmm, glass epoxy, 4-layer(2S2P)) is used.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating

Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.