LAN89218 datasheet(133/148 Pages) MICROCHIP

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DS60001255B-page 133

LAN89218

7.0

OPERATIONAL CHARACTERISTICS

Specifications are subject to change without notice.

7.1

Absolute Maximum Ratings*

Supply voltage (VDD_A, VDD_REF, VREG, VDD_IO) .............................................................................. 0 V to +3.6 V

Positive voltage on signal pins, with respect to ground (see Note 1)...................................................................................+6.0 V

Negative voltage on signal pins, with respect to ground (see Note 2)................................................................. -0.5 V

Positive voltage on XTAL1/CLKIN, with respect to ground .................................................................................. +4.6 V

Positive voltage on XTAL2, with respect to ground.............................................................................................. +2.5 V

Storage temperature ........................................................................................................................... -65 oC to +150 oC

Junction temperature ...........................................................................................................................................+150 oC

Lead temperature range............................................................................................ Refer to JEDEC Spec. J-STD-020

*Operation at or above these limits may damage the device.

Note 1:

This rating does not apply to the following pins: XTAL1/CLKIN, XTAL2, EXRES1.

Note 2:

This rating does not apply to the following pins: EXRES1.

7.2

Operating Conditions**

Supply voltage (VDD_A, VDD_REF, VREG, VDD_IO) ......................................................................... +3.3 V

300 mV

Junction temperature ......................................................................................................................... -40 oC to +125 oC

**Proper operation of the LAN89218 is guaranteed only within the ranges specified in this section.

7.3

Package Thermal Specifications

TABLE 7-1:

PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Unit

Comment

Thermal Resistance

ΘJA

oC/W

Measured from the die to ambient air.

Junction-to-Top-of-Package

ΨJT

1.25

oC/W

Note:

Thermal parameters are measured or estimated for devices in a multilayer 2S2P PCB per JESD51.

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