S29WS064N0LBAI011 datasheet(16/99 Pages) SPANSION

16 / 99 page

S29WS-N MirrorBit™ Flash Family

S29WS-N_00_G0 January25,2005

Adva nce

Information

4.3

MCP Look-ahead Connection Diagram

Figure 4.5 shows a migration path from the S29WS-N to higher densities and the option to include

additional die within a single package. Spansion LLC provides this standard look-ahead connection

diagram that supports

NOR Flash and SRAM densities up to 4 Gigabits

NOR Flash and pSRAM densities up to 4 Gigabits

NOR Flash and pSRAM and data storage densities up to 4 Gigabits

The following multi-chip package (MCP) data sheet(s) are based on the S29WS-N. Refer to these

documents for input/output descriptions for each product:

Publication Number S71WS256_512NC0.

The physical package outline may vary between connection diagrams and densities. The connec-

tion diagram for any MCP, however, is a subset of the pinout in Figure 4.5.

In some cases, outrigger balls may exist in locations outside the grid shown. These outrigger balls

are reserved; do not connect them to any other signal.

For further information about the MCP look-ahead pinout, refer to the Design-In Scalable Wireless

Solutions with Spansion Products application note, available on the web or through an AMD or

Fujitsu sales office.

S29WS064N0LBAI011 Datasheet(PDF) 16 Page - SPANSION