GC4016 datasheet(32/83 Pages) TI

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August 27, 2001

GC4016 MULTI-STANDARD QUAD DDC CHIP

DATA SHEET REV 1.0

This document contains information which may be changed at any time without notice

4.0

PACKAGING

4.1

GC4016-PB 160 Ball Plastic Ball Grid Array (PBGA)

The GC4016 chip is packaged in a 160 lead plastic ball grid array package.

Figure 17. GC4016 160 Pin Plastic Ball Grid Array

VCORE:

GND:

NOTE: 0.01 to 0.1

µf DECOUPLING CAPACITORS SHOULD BE PLACED

AS CLOSE AS POSSIBLE TO THE MIDDLE OF EACH SIDE OF THE CHIP

UNUSED:

DIMENSION

TYP

TOLERANCE

(width body)

15 mm

D1 (width cover)

13 mm

(ball pitch)

1.0 mm

(ball width)

0.5 mm

(overhang)

1.0 mm

(overall height)

1.56 mm

A1 (ball height)

0.4 mm

+-0,05 mm

+0.7 -0.05 mm

+-0.05 mm

+-0.1 mm

+-0.05 mm

+0.19 -0.21 mm

+-0.1 mm

0.4 mm

13 mm

1.56 mm

0.36 mm

1 2 3 4 5 6 7 8 9 10 11 12 13 14

1.0 mm

0.5 mm

GC4016-PB

QUAD DDC

MMMMMM

GRAYCHIP

TOP VIEW

BOTTOM VIEW

A2 (substrate thickness)

0.36 mm

+-0.05 mm

1.0 mm

VPAD:

C14, D2, L5, L13, M8, P3, P10

B14, C3, D6, D8, D10, G12, M3, P5, P12

A3, A12, L7, L9, M1, M5, N11

A2, B1, B2, B3, B13, C2, M2, M12, M13,

GND (THERMAL):

G7, G8, H7, H8

A8, A13, C1, D11, E4, G11, M14, N3, P4

MARKING:

MMMMMM = Mask Code

LLL = Lot Code

YYWW = Date Code

160 BALL PLASTIC BALL GRID ARRAY

N1, N2, N12, N13, N14, P2, P13

JTAG:

B12 (TCK), C10 (TMS), C12 (TDO), C13 (TDI)

LLL YYWW

GC4016 Datasheet(PDF) 32 Page - Texas Instruments

GC4016 Datasheet(HTML) 32 Page - Texas Instruments

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