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DS3172 Datasheet(PDF) 217 Page - Dallas Semiconductor |
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DS3172 Datasheet(HTML) 217 Page - Dallas Semiconductor |
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217 / 232 page ![]() DS3171/DS3172/DS3173/DS3174 217 of 232 16 PACKAGE THERMAL INFORMATION The 36 thermal VSS balls in the center 6X6 matrix must be thermally and electrically connected to the internal GND plane of the PC board to achieve these thermal characteristics. PARAMETER VALUE Target Ambient Temperature Range -40°C to +85°C Die Junction Temperature Range -40 to +125 °C Theta-JA, Still Air 12.6 °C/W (Note 1) Note 1: Theta-JA is based on the package mounted on a 4-layer JEDEC board and measured in a JEDEC test chamber. |
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