1769205x2, 176881212, 176861512

FISM

– Fixed Isolated SMT Module

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Würth Elektronik eiSos GmbH & Co. KG

– Data Sheet Rev. 1.0

©July 2018

31/37

SOLDER PROFILE

1.

Only Pb-Free assembly is recommended according to JEDEC J-STD020.

2.

Measure the peak reflow temperature of the MagI³C power module in the middle of the top view.

3.

Ensure that the peak reflow temperature does not exceed 240°C ±5°C as per JEDEC J-STD020.

4.

The reflow time period during peak temperature of 240°C ±5°C must not exceed 30 seconds.

5.

Reflow time above liquidus (217°C) must not exceed 150 seconds.

6.

Maximum ramp up is rate 3°C per second

7.

Maximum ramp down rate is 6°C per second

8.

Reflow time from room (25°C) to peak must not exceed 8 minutes as per JEDEC J-STD020.

9.

Maximum number of reflow cycles is one.

10. For minimum risk, solder the module in the last reflow cycle of the PCB production.

11. For soldering process please consider lead material copper (Cu) and lead finish tin (Sn).

12. For solder paste use a standard SAC Alloy such as SAC 305, type 3 or higher.

13. Below profile is valid for convection reflow only

14. Other soldering methods (e.g. vapor phase) are not verified and have to be validated by the customer on his own

risk

Time [sec]

150

200

217

Max 245

Max 120 sec

Min 60 sec

Max 150 sec

Min 60 sec

Max 30 sec

240°C

Ramp Up Rate

Max 3°C/sec

Ramp Down Rate

Max 6°C/sec

Max 2 solder cycles !

Preheat

Liquidus

Peak

DEFINITION OF SOLDER CYCLES

the reflow heating profile

Note: Module is not allowed to be glued and soldered upside down.