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LTC7813 Datasheet(PDF) 4 Page - Analog Devices |
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LTC7813 Datasheet(HTML) 4 Page - Analog Devices |
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4 / 28 page ![]() LTC7878 4 Rev. 0 For more information www.analog.com ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C. , VIN = 12V, RUN > 1.25V unless otherwise noted. (Note 2) Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC7878 is tested under pulsed load conditions such that TJ ≈ TA. The LTC7878A is guaranteed to meet specifications from –40°C to 125°C junction temperature. High junction temperatures degrade operating lifetimes; operating lifetime is derated for junction temperatures greater than 125°C. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal impedance and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the formula: TJ = TA + (PD • JA), where θJA (in °C/W) is the package thermal impedance. Note 3: When VIN > EXTVCC and EXTVCC > 8V, VBIAS supply current is transferred to EXTVCC pin to reduce the total input supply quiescent current. Note 4: The LTC7878 is tested in a feedback loop that servos VITH to a specified voltage and measures the resultant VFB. The specifications at –40°C and 125°C are not tested in production and are assured by design, characterization and correlation to production testing at other temperatures. Note 5: Dynamic supply current is higher due to the gate charge being delivered at the switching frequency. See Applications Information section. Note 6: Rise and fall times are measured using 10% and 90% levels. Delay times are measured using 50% levels. Note 7: The minimum on-time condition is specified for an inductor peak-to-peak ripple current > 40% of IL(MAX) (See Minimum On-Time Considerations in the Applications Information section). Note 8: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. The maximum rated junction temperature will be exceeded when this protection is active. Continuous operation above the specified absolute maximum operating junction temperature may impair device reliability or permanently damage the device. Note 9: Do not apply a voltage or current source to these pins. They must be connected to capacitive loads only, otherwise permanent damage may occur. Note 10: Guaranteed by design. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS DRVCC and INTVCC Linear Regulators VDRVCC DRVCC Regulation Voltage VIN = 12V, EXTVCC = 0V VIN = 5V, EXTVCC = 12V 6.8 6.8 7 7 7.2 7.2 V V VDRVCC_LREG DRVCC Voltage Load Regulation IDRVCC = 0mA to 55mA, VIN = 12V 1 2 % VINTVCC INTVCC Regulation Voltage 4.8 5 5.2 V Oscillator and Phase Locked Loop IFREQ FREQ Pin Output Current 9 10 11 µA fSW(MIN) Low Fixed Switching Frequency VFREQ = 0V 50 kHz fSW(MAX) High Fixed Switching Frequency VFREQ = 5V 800 kHz fSW_SYNC Synchronizable Frequency SYNC = External Clock 100 600 kHz VTH_SYNC SYNC Pin Input Threshold SYNC Pin Rising 1.2 2 V SYNC Pin Falling 0.5 0.9 V RSYNC SYNC Pin Input Resistance to Ground 500 kΩ Clock Output High Voltage 4.8 5 V Clock Output Low Voltage 0 0.2 V Power Good VPGOOD PGOOD Trip Level, VFB Respect to Set Regulated Voltage VFB Ramping Negative –10 % VFB Ramping Positive 10 % RPGOOD PGOOD Open Drain On-Resistance 55 Ω IPGOOD PGOOD Leakage Current VPGOOD = 6V ±1 µA Gate Drivers RTG1, RTG2 Top Driver Pull-Up On-Resistance BOOST – SW = 7V 3 Ω Top Driver Pull-Down On-Resistance BOOST – SW = 7V 1.5 Ω RBG1, RBG2 Bottom Driver Pull-Up On-Resistance DRVCC = 7V 3.5 Ω Bottom Driver Pull-Down On-Resistance DRVCC = 7V 3 Ω |
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