Data Sheet

ADPL42010A

analog.com

Rev. 0

23 of 28

PRINTED CIRCUIT BOARD (PCB) LAYOUT CONSIDERATIONS

It is important to give careful consideration to all sources of thermal resistance from junction-to-ambient when

designing the PCB layout for the ADPL42010A. Additional heat sources mounted nearby must also be considered.

Heat dissipation from the package can be improved by increasing the amount of copper directly attached to the pins

and exposed pad of the ADPL42010A. Thermal vias may be used to connect the exposed pad to copper on the

opposite side of the PCB. However, a point of diminishing returns is eventually reached, beyond which an increase

in the copper size does not yield significant heat dissipation benefits.

It is also important for electrical performance to give careful consideration to component placement and ground

layer placement when designing the PCB layout for the ADPL42010A. Place the input capacitor as close as possible

to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Place the input

and output capacitors on the same side of the PCB as the ADPL42010A with their ground terminals close to each

other. The input capacitor, output capacitor, and ADPL42010A grounds all connect on one side of the device, while

grounds for control signals connect to the ADPL42010A on the other side of the device. Utilize an unbroken ground

plane on the PCB layer that is adjacent to the top or bottom PCB layer with the ADPL42010A. Figure 34 shows a

recommended layout that delivers the full performance of the regulator.

Figure 34. ADPL42010A Example PCB Layout