LFEC10 datasheet(37/163 Pages) LATTICE

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DC and Switching_01.9

February 2008

Data Sheet

or product names are trademarks or registered trademarks of their respective holders. The speciﬁcations and information herein are subject to change without notice.

Recommended Operating Conditions

Absolute Maximum Ratings

1, 2, 3

1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

2. Compliance with the Lattice Thermal Management document is required.

3. All voltages referenced to GND.

Supply Voltage VCC . . . . . . . . . . . . . . . . . . . -0.5 to 1.32V

Supply Voltage VCCAUX . . . . . . . . . . . . . . . . -0.5 to 3.75V

Supply Voltage VCCJ . . . . . . . . . . . . . . . . . . -0.5 to 3.75V

Output Supply Voltage VCCIO . . . . . . . . . . . -0.5 to 3.75V

Dedicated Input Voltage Applied

4 . . . . . . . . -0.5 to 4.25V

I/O Tristate Voltage Applied

4 . . . . . . . . . . . . -0.5 to 3.75V

Storage Temperature (Ambient) . . . . . . . . . -65 to 150°C

Junction Temp. (Tj). . . . . . . . . . . . . . . . . . . . . . . . +125°C

4. Overshoot and undershoot of -2V to (VIHMAX + 2) volts is permitted for a duration of <20ns.

Symbol

Parameter

Min.

Max.

Units

VCC

Core Supply Voltage

1.14

1.26

VCCAUX

Auxiliary Supply Voltage

3.135

3.465

VCCPLL

PLL Supply Voltage for ECP/EC33

1.14

1.26

VCCIO

1, 2

I/O Driver Supply Voltage

1.140

3.465

VCCJ

Supply Voltage for IEEE 1149.1 Test Access Port

1.140

3.465

tJCOM

Junction Commercial Operation

°C

tJIND

Junction Industrial Operation

-40

100

°C

1. If VCCIO or VCCJ is set to 1.2V, they must be connected to the same power supply as VCC. If VCCIO or VCCJ is set to 3.3V, they must be con-

nected to the same power supply as VCCAUX.

2. See recommended voltages by I/O standard in subsequent table.

3. VCCAUX ramp rate must not exceed 3mV/µs for commercial and 0.6 mV/µs for industrial device operations during power up when transition-

ing between 0.8V and 1.8V.

Hot Socketing Speciﬁcations

1, 2, 3, 4

1. Insensitive to sequence of VCC, VCCAUX and VCCIO. However, assumes monotonic rise/fall rates for VCC, VCCAUX and VCCIO.

2. 0 ≤ VCC ≤ VCC (MAX), 0 ≤ VCCIO ≤ VCCIO (MAX) or 0 ≤ VCCAUX ≤ VCCAUX (MAX).

3. IDK is additive to IPU, IPW or IBH.

4. LVCMOS and LVTTL only.

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

Top and Bottom General Purpose sysI/Os (Banks 0, 1, 4 and 5), JTAG and Dedicated sysCONFIG Pins

IDK_TB

Input or I/O Leakage Current

0 ≤ VIN ≤ VIH (MAX.)

—

+/-1000

µA

Left and Right General Purpose sysI/Os (Banks 2, 3, 6 and 7)

IDK_LR

Input or I/O Leakage Current

VIN ≤ VCCIO

—

+/-1000

µA

VIN > VCCIO

—35—

LatticeECP/EC Family Data Sheet

DC and Switching Characteristics

LFEC10 Datasheet(PDF) 37 Page - Lattice Semiconductor

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