LPC3131 datasheet(2/68 Pages) NXP

2 / 68 page

LPC3130_3131_1

Preliminary data sheet

Rev. 1 — 9 February 2009

2 of 68

NXP Semiconductors

LPC3130/3131

Low-cost, low-power ARM926EJ-S microcontrollers

N PWM module

N Random Number Generator (RNG)

N General Purpose I/O (GPIO) pins

N Flexible and versatile interrupt structure

N JTAG interface with boundary scan and ARM debug access

I Operating voltage and temperature

N Core voltage: 1.2 V

N I/O voltage: 1.8 V, 2.8 V, 3.3 V

N Temperature: −40 °C to +85 °C

I TFBGA180 package: 12 × 12 mm2, 0.8 mm pitch

Ordering information

Table 1.

Ordering information

Type number

Package

Name

Description

Version

LPC3130FET180 TFBGA180 plastic thin ﬁne pitch ball grid array package, 180 balls, body 12

× 12 × 0.8 mm SOT570-3

LPC3131FET180 TFBGA180 plastic thin ﬁne pitch ball grid array package, 180 balls, body 12

× 12 × 0.8 mm SOT570-3

Table 2.

Ordering options for LPC3130/3131

Type number

Core/bus

frequency

Total

SRAM

High-speed

USB

10-bit

ADC

channels

I2S-bus/

I2C-bus

MCI SDHC/

SDIO/

CE-ATA

Temperature

range

LPC3130FET180

180 MHz/

90 MHz

96 kB

Device/

Host/OTG

2 each

yes

−40 °C to +85 °C

LPC3131FET180

180 MHz/

90 MHz

192 kB Device/

Host/OTG

2 each

yes

−40 °C to +85 °C

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