FS6131 datasheet(28/44 Pages) ONSEMI

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FS6131

8.0 Package Information for Both ‘Green’/’ROHS’ and ‘Non-Green’

Table 19: 16-pin SOIC (0.150") Package Dimensions

Dimension

Inches

Millimeters

Min.

Max.

Min.

Max.

0.061

0.068

1.55

1.73

0.004

0.0098

0.102

0.249

0.055

0.061

1.40

1.55

0.013

0.019

0.33

0.49

0.007

0.0098

0.191

0.249

0.386

0.393

9.80

9.98

0.150

0.157

3.81

3.99

0.050 BSC

1.27 BSC

0.230

0.244

5.84

6.20

0.010

0.016

0.25

0.41

0.016

0.035

0.41

0.89

8°

Table 20: 16-pin SOIC (0.150") Package Characteristics

Parameter

Symbol

Conditions/Description

Typ.

Units

Thermal Impedance, Junction to Free-Air

Air flow = 0 ft./min.

108

°C/W

Corner lead

4.0

Lead Inductance, Self

L11

Center lead

3.0

Lead Inductance, Mutual

L12

Any lead to any adjacent lead

0.4

Lead Capacitance, Bulk

C11

Any lead to VSS

0.5

9.0 Ordering Information

Part Number

Package

Shipping Configuration

Temperature Range

FS6131-01G-XTD

16-pin (0.150”) SOIC

(green, ROHS or lead free packaging)

Tube/Tray

0° C to 70° C (Commercial)

FS6131-01G-XTP

16-pin (0.150”) SOIC

(green, ROHS or lead free packaging)

Tape & Reel

0° C to 70° C (Commercial)

FS6131-01i-XTD

16-pin (0.150”) SOIC

(small outline package)

Tube/Tray

-40° C to 85° C (Industrial)

FS6131-01i-XTP

16-pin (0.150”) SOIC

(small outline package)

Tape & Reel

-40° C to 85° C (Industrial)

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