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TLE5012 Datasheet(PDF) 61 Page - Infineon Technologies AG |
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TLE5012 Datasheet(HTML) 61 Page - Infineon Technologies AG |
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61 / 64 page  TLE5012 Package Information Final Data Sheet 61 V 1.0, 2010-11 4 Package Information 4.1 Package Parameters 4.2 Package Outline Figure 32 PG-DSO-8 package dimensions Table 29 Package parameters Parameter Symbol Limit Values Unit Notes min. typ. max. Thermal resistance RthJA - 150 200 K/W Junction to air1) 1) According to Jedec JESD51-7 RthJC - - 75 K/W Junction to case RthJL - - 85 K/W Junction to lead Soldering moisture level MSL 3 260°C Lead frame Cu Plating Sn 100% > 7 µm |
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