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LPC18S50 Datasheet(PDF) 142 Page - NXP Semiconductors |
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LPC18S50 Datasheet(HTML) 142 Page - NXP Semiconductors |
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142 / 151 page ![]() LPC18S50_S30_S10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 1 — 23 February 2015 142 of 151 NXP Semiconductors LPC18S50/S30/S10 32-bit ARM Cortex-M3 microcontroller Fig 54. Reflow soldering of the TFBGA180 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT570-3 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA180 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot570-3_fr 0.80 0.400 0.400 0.550 12.575 12.575 |
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