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LINR2 Datasheet(PDF) 102 Page - fujitsu semiconductor |
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LINR2 Datasheet(HTML) 102 Page - fujitsu semiconductor |
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102 / 108 page ![]() MB96320 Series 102 FME-MB96320 rev 7 ■ PACKAGE DIMENSION MB96(F)32x LQFP 80 Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/en-search/ 80-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 12 mm × 12 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.47 g Code (Reference) P-LFQFP80-12 ×12-0.50 80-pin plastic LQFP (FPT-80P-M21) (FPT-80P-M21) C 2006 FUJITSU LIMITED F80035S-c-2-2 120 40 21 60 41 80 61 INDEX 12.00±0.10(.472±.004)SQ 14.00±0.20(.551±.008)SQ 0.50(.020) 0.20±0.05 (.008±.002) M 0.08(.003) 0.145±0.055 (.006±.002) 0.08(.003) "A" 0˚~8˚ .059 –.004 +.008 –0.10 +0.20 1.50 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.05 (.004±.002) (Stand off) 0.25(.010) Details of "A" part LEAD No. (Mounting height) * Dimensions in mm (inches). Note: The values in parentheses are reference values ©2006-2008 FUJITSU MICROELECTRONICS LIMITED F80035S-c-2-3 Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3)Pins width do not include tie bar cutting remainder. |
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