Phone:

+49 371 33 77 - 0

Fax::

+49 371 33 77 272

Internet:

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Email:

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sales@gemac-chemnitz.de

GEMAC

Gesellschaft für

Mikroe lektronikanwendung Chemnitz mbH

Zwickauer Straße 227

D-09116 Chemnitz, Germany

Date: 20.04.04

Page 28 of 30

Title:

Data Sheet GC-IP200

Name of Document:

43500-DB-2-1-E-IP200.pdf

12.4

Bond Pattern

ADC

ADC

Digital Circuit

Analog Circuit

IP200

3723 ; 339,85 PH

3723 ; 590,50 V0S180

3723 ; 830,00 VDDA3

3723 ; 991,25 VSSA3

3723 ; 1166,05 V0C

3723 ; 1376,35 IT2

3723 ; 1581,05 IT1

3723 ; 1785,75 IR2

V0S

58 ; 345,40

REFP 58 ; 571,65

REFN 58 ; 758,50

VDDA1 58 ; 988,85

VSSA1 58 ; 1162,85

TM

58 ; 1382,30

VDD3 58 ; 1639,80

VSSZ 58 ; 1798,20

SDO

57 ; 2164,80

SDI

57 ; 2342,15

SCEN

57 ; 2555,10

SCLK

57 ; 2780,70

XA

57 ; 3056,70

XB

57 ; 3214,70

CLRTRG

57 ; 3472,10

OUTHIGH

57 ; 3681,75

VDD2

57 ; 3902,80

VSS2

57 ; 4099,25

3724 ; 4101,75 VSS1

3724 ; 3894,30 VDD1

3724 ; 3671,10 NRES

3724 ; 3457,00 NERR

3724 ; 3246,90 TRG

3724 ; 3015,90 A

3724 ; 2819,30 B

3724 ; 2634,20 OREF

3724 ; 2376,10 IR0

3724 ; 2198,60 IR1

x -35; y -35

lower left corner

upper right corner

x 3915 ; y 4665

Notes:

1. All linear dimensions are in µm.

2. All pad dimensions refer to metall layer 2.

3. Pad size: 99,000 x 99,000.

4. Pad center point: X+49,500 x Y+49,500.

5. Dimension of lower left corner of bond window refer to pad dimensions: X+7,000 x Y+7,000.

6. Size of bond window: 85,000 x 85,000.

y

x