LTC9101-2/LTC9102

43

Rev. 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.50 BSC

9.50 REF

5.50 REF

6.10 ±0.05

7.50 ±0.05

4.40 ±0.05

8.80 ±0.05

4.80 ±0.05

10.10 ±0.05

11.50 ±0.05

0.25 ±0.05

PACKAGE

OUTLINE

7.00 ±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

63

1

2

BOTTOM VIEW—EXPOSED PAD

9.50 REF

11.00 ±0.10

0.75 ±0.05

R = 0.125

TYP

R = 0.10

TYP

0.25 ±0.05

(UKJ64) QFN 0119 REV Ø

0.50 BSC

0.200 REF

0.00 – 0.05

5.50 REF

0.40 ±0.10

8.80 ±0.10

4.40

±0.10

4.80 ±0.10

0.55 REF

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35 × 45° CHAMFER

64

UKJ Package

64-Lead Plastic QFN (7mm × 11mm)

(Reference LTC DWG # 05-08-1780 Rev Ø)

UKJ Package

64-Lead Plastic QFN (7mm × 11mm)

(Reference LTC DWG # 05-08-1780 Rev 0)