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RT600 Datasheet(PDF) 107 Page - NXP Semiconductors

Part # RT600
Description  Dual-core microcontroller with 32-bit Cortex®-M33 and Xtensa HiFi4 Audio DSP CPUs; Up to 4.5 MB SRAM; FlexSPI with cache and dynamic decryption; High-speed USB device/host
PDF  171 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

RT600 Datasheet(HTML) 107 Page - NXP Semiconductors

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RT600
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors B.V. 2023. All rights reserved.
Product data sheet
Rev. 2.1 — 7 July 2023
107 of 173
NXP Semiconductors
RT600
Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4
Audio DSP CPUs
14. Dynamic characteristics
14.1 Wake-up process
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2] The wake-up time measured is the time between when a GPIO input pin is triggered to wake the device up
from the low power modes and from when a GPIO output pin is set in the interrupt service routine (ISR)
wake-up handler.
[3] IRC disabled, all peripherals off. PLL disabled.
[4] Wake up from deep power-down causes the part to go through entire reset process. The wake-up time
measured is the time between when the Wake-Up pin is triggered to wake the device up and when a GPIO
output pin is set in the reset handler.
14.2 IRC (48 MHz/60 MHz and 16 MHz)
The 48 MHz/60 MHz IRC is trimmed to +/- 1% accuracy over the entire voltage and 0 C to
70 C temperature range.
The 48 MHz/60 MHz IRC is trimmed to +1.5% and - 1% accuracy over the entire voltage
and -20 C to 70 C temperature range.
The 48 MHz/60 MHz IRC is trimmed to +/- 1.5% over the entire voltage and -20 C to 85 C
temperature range.
The 16 MHz IRC is trimmed to ±3% accuracy over the entire voltage and temperature
range.
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
Table 31. Dynamic characteristic: Typical wake-up times from low power modes
Tamb = 25 C; using IRC as the system clock.
Symbol Parameter Conditions
Min
Typ[1]
Max Unit
twake
wake-up
time
from sleep mode, 250 MHz
[2][3] -
1.5
-
s
from sleep mode, 12 MHz
[2][3] -
6.2
-
s
twake
wake-up
time
from deep-sleep mode
[2][3] -
637
-
s
twake
wake-up
time
from deep power-down mode
using RESETN.
[4] -
5.6
-
ms
from deep power-down mode
using PMIC_IRQ_N.
[4] -
7
-
ms
twake
wake-up
time
from full deep power-down mode
using RESETN.
[4] -
5.6
-
ms
from full deep power-down mode
using PMIC_IRQ_N.
[4] -
7.6
-
ms
Table 32. Dynamic characteristic: IRC
Tamb = 0 C to +70 C; 1.71 V to 3.6 V.
Symbol
Parameter
Conditions Min
Typ[1]
Max
Unit
fosc(RC)
IRC clock frequency
-
15.52
16
16.48
MHz
fosc(RC)
IRC clock frequency
-
47.52
48
48.48
MHz
fosc(RC)
IRC clock frequency
-
59.4
60
60.6
MHz



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