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RT600 Datasheet(PDF) 98 Page - NXP Semiconductors

Part # RT600
Description  Dual-core microcontroller with 32-bit Cortex®-M33 and Xtensa HiFi4 Audio DSP CPUs; Up to 4.5 MB SRAM; FlexSPI with cache and dynamic decryption; High-speed USB device/host
PDF  171 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

RT600 Datasheet(HTML) 98 Page - NXP Semiconductors

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RT600
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© NXP Semiconductors B.V. 2023. All rights reserved.
Product data sheet
Rev. 2.1 — 7 July 2023
98 of 173
NXP Semiconductors
RT600
Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4
Audio DSP CPUs
13.3 CoreMark data
[1] Clock source IRC. PLL disabled.
[2] Clock source external clock to XTALIN (bypass mode). PLL enabled.
[3] Characterized through bench measurements using typical samples.
[4] Compiler settings: IAR C/C++ Compiler for Arm ver 8.32.3, High, Speed, No Size Constraints.
[5] VDD_AO1V8 = VDD1V8 = VDDIO_0/1/2 = VDDA_ADC1V8 = 1.8 V. VDDA_BIAS = VREFP = 1.8 V. USB1_VDD3V3 = 3.3 V.
[6] For SDK version 2.8 and before (SDK Power Library version = 0x020200): The maximum frequency for the specified VDDCORE
voltage is the frequency of the main clock. This is before the CPU CLOCK Divider. The VDDCORE voltage has to be set according to
the chosen main clock frequency. For SDK version 2.8.3 and after (SDK Power Library version = 0x02030): The maximum frequency for
the specified VDDCORE voltage is the frequency of the clock after CPU CLOCK and DSP clock Divider. The VDDCORE voltage has to
be set according to the chosen M33 CPU and DSP CPU clock frequency. Please see Figure 6 “RT600 clock generation”.
[7] 4.5 MB SRAM enabled. All peripheral clocks disabled (set to NONE). All Array Power enabled (PDRUNCFG 1/2 registers). Only SRAM
partition 12 access enabled (SYSCTL0_AHB_SRAM_ACCESS_DISABLE register). SYSCPUAHBCLKDIV = 0x0.
13.4 Power consumption
Table 23. CoreMark score
Tamb = 25C
Parameter
Conditions
Typ [3][4][5]
Unit
ARM Cortex-M33 in active mode, DSP no clock
CoreMark score
CoreMark code executed from SRAM;
CCLK = 12 MHz, VDDCORE = 0.7 V
[1][6][7]
3.87
(Iterations/s) / MHz
CCLK = 48 MHz, VDDCORE = 0.7 V
[1][6][7]
3.87
(Iterations/s) / MHz
CCLK = 60 MHz, VDDCORE = 0.7 V
[1][6][7]
3.87
(Iterations/s) / MHz
CCLK = 80 MHz, VDDCORE = 0.8 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 110 MHz, VDDCORE = 0.8 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 144 MHz, VDDCORE = 0.9 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 180 MHz, VDDCORE = 0.9 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 204 MHz, VDDCORE = 0.9 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 240 MHz, VDDCORE = 1.0 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 270 MHz, VDDCORE = 1.0 V
[2][6][7]
3.87
(Iterations/s) / MHz
CCLK = 300 MHz, VDDCORE = 1.13 V
[2][6][7]
3.87
(Iterations/s) / MHz
Table 24. Static characteristics: Power consumption in active mode
Tamb = -20C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[2][4][5] Max
Unit
Cortex-M33 in Active mode, DSP no clock[1]
IDDVDDCORE
VDDCOREsupply
current
enhanced while (1) code executed
from SRAM; Internal LDO disabled
CCLK = 12 MHz,
VDDCORE = 0.7 V
[3][6][7]
-
3.0
-
mA
CCLK = 48 MHz
VDDCORE = 0.7 V
[3][6][7]
-
6.0
-
mA
CCLK = 60 MHz
VDDCORE = 0.7 V
[3][6][7]
-
7.0
-
mA
CCLK = 80 MHz
VDDCORE = 0.8 V
[6][7][8]
-
10
-
mA



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