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RT600 Datasheet(PDF) 98 Page - NXP Semiconductors |
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RT600 Datasheet(HTML) 98 Page - NXP Semiconductors |
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98 / 171 page ![]() RT600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors B.V. 2023. All rights reserved. Product data sheet Rev. 2.1 — 7 July 2023 98 of 173 NXP Semiconductors RT600 Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4 Audio DSP CPUs 13.3 CoreMark data [1] Clock source IRC. PLL disabled. [2] Clock source external clock to XTALIN (bypass mode). PLL enabled. [3] Characterized through bench measurements using typical samples. [4] Compiler settings: IAR C/C++ Compiler for Arm ver 8.32.3, High, Speed, No Size Constraints. [5] VDD_AO1V8 = VDD1V8 = VDDIO_0/1/2 = VDDA_ADC1V8 = 1.8 V. VDDA_BIAS = VREFP = 1.8 V. USB1_VDD3V3 = 3.3 V. [6] For SDK version 2.8 and before (SDK Power Library version = 0x020200): The maximum frequency for the specified VDDCORE voltage is the frequency of the main clock. This is before the CPU CLOCK Divider. The VDDCORE voltage has to be set according to the chosen main clock frequency. For SDK version 2.8.3 and after (SDK Power Library version = 0x02030): The maximum frequency for the specified VDDCORE voltage is the frequency of the clock after CPU CLOCK and DSP clock Divider. The VDDCORE voltage has to be set according to the chosen M33 CPU and DSP CPU clock frequency. Please see Figure 6 “RT600 clock generation”. [7] 4.5 MB SRAM enabled. All peripheral clocks disabled (set to NONE). All Array Power enabled (PDRUNCFG 1/2 registers). Only SRAM partition 12 access enabled (SYSCTL0_AHB_SRAM_ACCESS_DISABLE register). SYSCPUAHBCLKDIV = 0x0. 13.4 Power consumption Table 23. CoreMark score Tamb = 25C Parameter Conditions Typ [3][4][5] Unit ARM Cortex-M33 in active mode, DSP no clock CoreMark score CoreMark code executed from SRAM; CCLK = 12 MHz, VDDCORE = 0.7 V [1][6][7] 3.87 (Iterations/s) / MHz CCLK = 48 MHz, VDDCORE = 0.7 V [1][6][7] 3.87 (Iterations/s) / MHz CCLK = 60 MHz, VDDCORE = 0.7 V [1][6][7] 3.87 (Iterations/s) / MHz CCLK = 80 MHz, VDDCORE = 0.8 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 110 MHz, VDDCORE = 0.8 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 144 MHz, VDDCORE = 0.9 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 180 MHz, VDDCORE = 0.9 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 204 MHz, VDDCORE = 0.9 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 240 MHz, VDDCORE = 1.0 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 270 MHz, VDDCORE = 1.0 V [2][6][7] 3.87 (Iterations/s) / MHz CCLK = 300 MHz, VDDCORE = 1.13 V [2][6][7] 3.87 (Iterations/s) / MHz Table 24. Static characteristics: Power consumption in active mode Tamb = -20C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[2][4][5] Max Unit Cortex-M33 in Active mode, DSP no clock[1] IDDVDDCORE VDDCOREsupply current enhanced while (1) code executed from SRAM; Internal LDO disabled CCLK = 12 MHz, VDDCORE = 0.7 V [3][6][7] - 3.0 - mA CCLK = 48 MHz VDDCORE = 0.7 V [3][6][7] - 6.0 - mA CCLK = 60 MHz VDDCORE = 0.7 V [3][6][7] - 7.0 - mA CCLK = 80 MHz VDDCORE = 0.8 V [6][7][8] - 10 - mA |
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