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EP11 Datasheet(PDF) 22 Page - Power Integrations, Inc. |
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EP11 Datasheet(HTML) 22 Page - Power Integrations, Inc. |
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22 / 46 page ![]() EPR-00011 - 70 W Adapter 22-Jan-01 Page 22 of 46 Power Integrations Inc Tel: +1 408 414 9200 Fax: +1 408 414 9201 www: http://www.powerint.com Figure 12 - Schematic cross-section of enclosure Note: The diagram above shows an exploded view. In actual construction, there are no air gaps between the board, copper heat spreader and case. The main path for heat dissipation is via conduction therefore air gaps, even small, greatly increase the thermal impedance from the heatsinks to ambient. Air gaps will reduce power capability and increase the temperature of components. Thermal Results in Enclosure 0 20 40 60 80 100 120 140 0 2 4 6 8 10 12 14 16 18 Elapsed Time (Hours) Top249 tab Bridge CM Choke Bulk/Xcap Opto Enc. Top Enc. Side Snubber T-former D5 tab D1 tab Ambient 1 Ambient 2 Figure 13 - Thermal results in enclosure at elevated ambient with 60, 65,70, and 72.5 Watt loads – 90 VAC 72.5 W 70 W 65 W 60 W |
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