IMX93CEC datasheet(1/126 Pages) NXP

Part #	IMX93CEC

Description	i.MX 93 Application Processors Data Sheet for Commercial Products

PDF	126 Pages

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Manufacturer	NXP [NXP Semiconductors]

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMX93CEC

Rev. 3, 12/2023

MIMX9352DVVXMAB

MIMX9351DVVXMAB

MIMX9332DVVXMAB

MIMX9331DVVXMAB

MIMX9302DVVXDAB

MIMX9301DVVXDAB

MIMX9322DVXXMAB

MIMX9321DVXXMAB

MIMX9312DVXXMAB

MIMX9311DVXXMAB

Package Information

Plastic Package

FCBGA 11 x 11 mm, 0.5 mm pitch

FCBGA 9 x 9 mm, 0.5 mm pitch

Ordering Information

See Table 2 on page 5

NXP reserves the right to change the production detail specifications as may be required to permit

improvements in the design of its products.

1

i.MX 93 introduction

The i.MX 93 family represents NXP’s latest

power-optimized processors for smart home, building

control, contactless HMI, IoT edge, Automotive, and

Industrial applications.

The i.MX 93 includes powerful dual Arm® Cor-

tex®-A55 processors with speeds up to 1.7 GHz inte-

grated with a NPU that accelerates machine learning

inference. A general-purpose Arm® Cortex®-M33 run-

ning up to 250 MHz is for real-time and low-power pro-

cessing. Robust control networks are possible via

CAN-FD interface. Also, dual 1 Gbps Ethernet control-

lers, one supporting Time Sensitive Networking (TSN),

drive gateway applications with low latency.

The i.MX 93 Commercial qualified part is particularly

useful for applications such as:

•

Home automation

•

Smart home hub/hue bridge

•

Audio sounder-bar

•

Smart doorbell

i.MX 93 Application

Processors Data Sheet

for Commercial Products

1. i.MX 93 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4

2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1. Special signal considerations . . . . . . . . . . . . . . . 13

3.2. Unused input and output guidance . . . . . . . . . . . 13

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 15

4.2. Power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.3. Power supplies requirements and restrictions . . . 27

4.4. PLL electrical characteristics . . . . . . . . . . . . . . . . 28

4.5. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 29

4.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 31

4.7. Differential I/O output buffer impedance . . . . . . . 33

4.8. System modules timing . . . . . . . . . . . . . . . . . . . . 33

4.9. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 38

4.10. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

4.11. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

4.12. External peripheral interface parameters . . . . . . . 51

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 87

5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 87

5.2. Boot device interface allocation . . . . . . . . . . . . . . 88

6. Package information and contact assignments . . . . . . . 92

6.1. 11 x 11 mm package information . . . . . . . . . . . . . 92

6.2. 9 x 9 mm package information . . . . . . . . . . . . . . 108

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

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