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IMX93CEC Datasheet(PDF) 13 Page - NXP Semiconductors

Part # IMX93CEC
Description  i.MX 93 Application Processors Data Sheet for Commercial Products
PDF  126 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMX93CEC Datasheet(HTML) 13 Page - NXP Semiconductors

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i.MX 93 Application Processors Data Sheet for Commercial Products, Rev. 3, 12/2023
NXP Semiconductors
13
3.1
Special signal considerations
Table 4 lists special signal considerations for the i.MX 93 processors. The signal names are listed in
alphabetical order.
The package contact assignments can be found in Section 6, Package information and contact
assignments.” Signal descriptions are provided in the i.MX 93 Reference Manual (IMX93RM).
3.2
Unused input and output guidance
If a function of the i.MX 93 is not used, the I/Os and power rails of that function can be terminated to
reduce overall board power. Table 5 is recommended connectivities for LVDS and other digital I/Os. Table
6 is recommended connectivities for MIPI. Table 7 is recommended connectivities for USB.
Table 4. Special signal considerations
Signal Name
Remarks
CLKIN1/CLKIN2
CLKIN1 and CLKIN2 are input pins without internal pull-up and pull-down. An external 10K
pull-down resistor is recommended if they are not used.
NC
These signals are No Connect (NC) and should be unconnected in the application.
ONOFF
A brief connection to GND in the OFF mode causes the internal power management state machine
to change the state to ON. In the ON mode, a brief connection to GND generates an interrupt
(intended to be a software-controllable power-down). Approximately five seconds (or more) to GND
causes a forced OFF.
POR_B
POR_B has no internal pull-up/down resistor, and requires external pull-up resistor to
NVCC_BBSM_1P8.
It is recommended that POR_B is properly handled during power up/down. Please see the EVK
design for details.
RTC_XTALI/RTC_XTALO To hit the exact oscillation frequency, the board capacitors must be reduced to account for the
board and chip parasitics. The integrated oscillation amplifier is self-biasing, but relatively weak.
Care must be taken to limit the parasitic leakage from RTC_XTALI and RTC_XTALO to either the
power or the ground (> 100 M
). This de-biases the amplifier and reduces the start-up margin.
If you want to feed an external low-frequency clock into RTC_XTALI, the RTC_XTALO pin must
remain unconnected or driven by a complementary signal. The logic level of this forcing clock must
not exceed the NVCC_BBSM_1P8 level and the frequency shall be < 50 kHz under the typical
conditions.
XTALI_24M/XTALO_24M The system requires 24 MHz on XTALI/XTALO. The crystal cannot be eliminated by the external
24 MHz oscillator.
The logic level of this forcing clock must not exceed the VDD_ANA0_1P8 level.
If this clock is used as a reference for USB, then there are strict frequency tolerance and jitter
requirements. See Section 4.1.6, Clock sources and relevant interface specifications chapters for
details.
Table 5. Unused function strapping recommendations
Function
Ball name
Recommendations
if unused
ADC
ADC_IN0, ADC_IN1, ADC_IN2, ADC_IN3
Tie to ground
TAMPER TAMPER0, TAMPER1
Tie to ground
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