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PM8621 Datasheet(PDF) 181 Page - PMC-Sierra, Inc |
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PM8621 Datasheet(HTML) 181 Page - PMC-Sierra, Inc |
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181 / 184 page ![]() NSE-8G™ Standard Product Data Sheet Preliminary Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use 180 Document ID: PMC-2010850, Issue 1 18 Ordering and Thermal Information 18.1 Packaging Information Part No. Description PM8621-BIAP 480 Uni Ball Grid Array (UBGA) Package 18.2 Thermal Information In full operation (10–12 ports), the NSE-8G is designed to operate over a wide temperature range when used with a heat sink with a worst case Junction to case Tj (Tjc) of 1 °C/W and is suited for industrial applications such as outside plant equipment Maximum long-term operating junction temperature to ensure adequate long-term life 105 0C Maximum junction temperature for short-term excursions with guaranteed continued functional performance. 1 This condition will typically be reached when local ambient reaches 70 Deg C. 125 0C Minimum ambient temperature -40 0C Device Compact Model 2 ΘJC ( 0C/W) # 1 ΘJB ( 0C/W) # 4 Operating power is dissipated in package (watts) at worst case power supply Power (watts) 2.56 ΘSA and ΘCS required for long- term operation 3 ΘSA + ΘCS ( 0C/W)4 #5 Notes 1. Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core 2. ΘJC, the junction-to-case thermal resistance is a measured nominal value + 2 sigma. ΘJB, the junction- to-board thermal resistance is obtained by simulating conditions described in JEDEC Standard, JESD 51 3. ΘSA is the thermal resistance of the heat sink to ambient. ΘCS is the thermal resistance of the heat sink attached material 4. The actual ΘSA required may vary according to the air speed at the location of the device in the system with all the components in place Device Compact Model Θ Θ Θ ΘSA Θ Θ Θ ΘCS Θ Θ Θ ΘJC Θ Θ Θ ΘJB Ambient Heat Sink Case Junction Board |
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