PM8621 datasheet(182/184 Pages) PMC

182 / 184 page

NSE-8G™ Standard Product Data Sheet

Preliminary

Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use

181

Document ID: PMC-2010850, Issue 1

Junction

Board

Ambient

Device

Compact

Model

ΘJT

ΘJB

In partial operation (less than 10 ports), this product is designed to operate over a

wide temperature range and is suited for industrial applications such as outside

plant equipment.

Maximum long-term operating junction temperature to ensure adequate long-term

life

105

Maximum junction temperature for short-term excursions with guaranteed

continued functional performance

This condition will typically be reached when

local ambient reaches 85 Deg C.

125

Minimum ambient temperature

-40

Thermal Resistance vs Air Flow

Airflow

Natural Convection

200 LFM

400 LFM

ΘJA (

0C/W)

13.5

12.2

11.8

Device Compact Model

ΘJT (

0C/W)

# 1

ΘJB (

0C/W)

# 4

Operating power is dissipated in package (watts) at

worst case power supply

Power (watts)

2.56

Notes

Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core

ΘJA , the total junction to ambient thermal resistance as measured according to JEDEC Standard

JESD51 (2S2P)

ΘJB, the junction-to-board thermal resistance and ΘJT, the residual junction to ambient thermal

resistance are obtained by simulating conditions described in JEDEC Standard, JESD 15-8

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