TPS25751AS datasheet(8/88 Pages) TI2

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6.2 ESD Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/

ESDA/JEDEC JS-001, all pins(1)

±1000

Charged-device model (CDM), per ANSI/

ESDA/JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3.1 TPS25751AD - Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

MIN

MAX

UNIT

Input voltage range(1)

VIN_3V3

3.0

3.6

PP5V

4.9

5.5

ADCIN1, ADCIN2, VBUS_IN,

VBUS

PPHV

VIO

I/O voltage range(1)

I2Cx_SDA, I2Cx_SCL, I2Cx_IRQ ,

ADCIN1, ADCIN2

3.6

GPIOx

5.5

CC1, CC2

5.5

IPP_HV

Current from VBUS_IN to PPHV

Output current (from LDO_3V3)

GPIOx

Output current (from VBUS LDO)

Sum of current from LDO_3V3 and

GPIOx

Ambient operating temperature

IPP_5V = 0, IPP_HV ≤ 7A, IPP_CABLE =

–40

°C

IPP_5V = 0,IPP_HV ≤ 6A, IPP_CABLE =

–40

TJ_PPHV

Operating junction temperature

PP_HV switch

–40

150

°C

Operating junction temperature

–40

125

°C

(1)

All voltage values are with respect to network GND. All GND pins must be connected directly to the GND plane of the board.

TPS25751A

SLVSJG7 – MAY 2026

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