Electronic Components Datasheet Search
  English  ▼

X  

Q6000 Datasheet(PDF) 87 Page - Intel Corporation

Part # Q6000
Description  on 65 nm Process in the 775-land LGA Package supporting Intel 64 architecture
PDF  98 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

Q6000 Datasheet(HTML) 87 Page - Intel Corporation

Back Button Q6000 Datasheet HTML 83Page - Intel Corporation Q6000 Datasheet HTML 84Page - Intel Corporation Q6000 Datasheet HTML 85Page - Intel Corporation Q6000 Datasheet HTML 86Page - Intel Corporation Q6000 Datasheet HTML 87Page - Intel Corporation Q6000 Datasheet HTML 88Page - Intel Corporation Q6000 Datasheet HTML 89Page - Intel Corporation Q6000 Datasheet HTML 90Page - Intel Corporation Q6000 Datasheet HTML 91Page - Intel Corporation Next Button
Zoom Inzoom in Zoom Outzoom out
 87 / 98 page
background image
Datasheet
87
Boxed Processor Specifications
7
Boxed Processor Specifications
The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators. Unless otherwise noted, all figures in
this chapter are dimensioned in millimeters and inches [in brackets]. Figure 22 shows a
mechanical representation of a boxed processor.
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the appropriate Thermal and Mechanical Design
Guidelines (see Section 1.2).
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 22.
Mechanical Representation of the Boxed Processor



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com