R261 datasheet(25/28 Pages) ONSEMI

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BelaSigna R261

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Serial Peripheral Interface (SPI) Port

An SPI port is available on BelaSigna R261 for

applications such as communication with a non−volatile

memory (EEPROM). The I/O levels on this port are defined

by the voltage on the VDDO pin. The SPI port operates in

master mode only, which supports communications with

slave SPI devices. The four signals needed by the SPI port

are multiplexed with other functions on BelaSigna R261

(GPIOs, LSADs). The use of the SPI port is excluding the

use of these other functions.

Interfaces Unused by the ROM−based Application

BelaSigna R261 also contains hardware provisions for a

high speed PCM interface, as well as a high speed UART.

These two interfaces are not used by the ROM−based

application, hence cannot be used by default. Custom

applications developed by ON Semiconductor could enable

the use of these interfaces, should this be required.

Long Term Storage Conditions

ON Semiconductor specifies a 24−month maximum

storage time for WLCSP devices in pocket tapes and

conditioned in dry bags, as stated in Table 16 below and

defined in ON Semiconductor’s “Finished Goods Packing

and Long Term Storage Procedures”. (Document #

12MRB17500B)

Table 16. LONG TERM STORAGE CONDITIONS

Storage Condition

Maximum Storage Time

Remarks

temperature 18−28°C,

humidity 30−65%RH

24 months after die

singulation/sawing date

Maximum 12 months storage at condition 18−28°C, 30−65%RH. After-

wards storage in vacuum moisture bag with desiccant and humidity card.

Storage in nitrogen cabinet allowed.

Re−Flow Information

The re−flow profile depends on the equipment that is used

for the re−flow and the assembly that is being re−flowed.

Care must be taken not to expose the packages to

temperatures above the rated features. The WLCSP package

is tested to perform reliably up to 3x reflow passes at the

maximum reflow peak temperature of 260

°C. Use Table 17

from the JEDEC Standard 22−A113D and J−STD−020D as

a guideline but note that actual profiles should be developed

by customers based on specific process needs and board

designs.

Table 17. RE−FLOW INFORMATION

Profile Feature

Pb−free Assembly

Preheat & Soak

Temperature minimum (TSMIN)

Temperature maximum (TSMAX)

Time (TSMIN to TSMAC) (TS)

150°C

200°C

60−120 seconds

Average Ramp−Up Rate

(TSMAX to TP)

3°C/second maximum

Liquidous temperature and time

Temperature (TL)

Time (tL)

217°C

60−150 seconds

Peak Temperature (TP)

260 +0/−5°C

Time within 5°C of Actual Peak

Temperature

20−40 seconds

Ramp−Down Rate (TP to TSMAX)

6°C/second maximum

Time 25°C to Peak Temperature

8 minutes maximum

Miscellaneous

Chip Identification

Chip identification information can be retrieved by using

the Communications Accelerator Adaptor (CAA) tool along

with the protocol software provided by ON Semiconductor.

For BelaSigna R261, the key identifier components and

values are as follows:

Chip Family

Chip Version

0x02 (SK2)

0x3010

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