BelaSigna R261

http://onsemi.com

28

Assembly / Design Notes

For

PCB

manufacture with BelaSigna R261,

ON Semiconductor recommends solder−on−pad (SoP)

surface finish. With SoP, the solder mask opening should be

non−solder mask−defined (NSMD) and copper pad

geometry will be dictated by the PCB vendor’s design

requirements.

Alternative surface finishes are ENiG and OSP; volume

of screened solder paste (#5) should be less than

then the following conditions must be met:

1. the solder mask opening should be >0.3 mm in

diameter,

2. the copper pad will have 0.25 mm diameter, and

3. solder mask thickness should be less than 1 mil

thick above the copper surface.

ON Semiconductor can provide BelaSigna R261

mounting foot print guidelines to assist your PCB design

upon request.

Table 18. ORDERING INFORMATION

Device

Marking

Package

BR261W30A101E1G

BR261W30

WLCSP30

2500 / Tape & Reel

BR261W26A101E1G

BR261W26

WLCSP26

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specification Brochure, BRD8011/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

BR261/D

BelaSigna is a registered trademark of Semiconductor Components Industries, LLC.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative