UPD784021 datasheet(82/90 Pages) NEC

82 / 90 page

mPD784020, 784021

16. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the

mPD784021.

For details of the recommended soldering conditions, refer to our document

SMD Surface Mount Technology

Manual (C10535E).

Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under

different conditions.

Table 16-1 Soldering Conditions for Surface-Mount Devices

(1)

mPD784020GC-3B9 : 80-pin plastic QFP (14 ¥ 14 mm)

mPD784021GC-3B9 : 80-pin plastic QFP (14 ¥

¥ 14 mm)

(2)

mPD784021GK-BE9: 80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm)

Note

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: Temperature of 25 ½C and maximum relative humidity at 65 % or less

Caution Do not apply more than a single process at once, except for “Partial heating method.”

Soldering conditions

Peak package’s surface temperature: 235 ½C

Reflow time: 30 seconds or less (at 210 ½C or more)

Maximum allowable number of reflow processes: 3

Peak package’s surface temperature: 215 ½C

Reflow time: 40 seconds or less (at 210 ½C or more)

Maximum allowable number of reflow processes: 3

Solder temperature: 260 ½C or less

Flow time: 10 seconds or less

Number of flow process: 1

Preheating temperature: 120 ½C max. (measured on the package

surface)

Terminal temperature: 300 ½C or less

Flow time: 3 seconds or less (for each side of device)

Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Soldering conditions

Peak package’s surface temperature: 235 ½C

Reflow time: 30 seconds or less (at 210 ½C or more)

Maximum allowable number of reflow processes: 2

Exposure limitNote:

7 days (10 hours of pre-baking is required at

125 ½C afterward.)

Non-heat resistant trays, such as magazine and taping trays, cannot

be baked before unpacking.

Peak package’s surface temperature: 215 ½C

Reflow time: 40 seconds or less (at 200 ½C or more)

Maximum allowable number of reflow processes: 2

Exposure limitNote:

7 days (10 hours of pre-baking is required at

125 ½C afterward.)

Non-heat resistant trays, such as magazine and taping trays, cannot

be baked before unpacking.

Terminal temperature: 300 ½C or less

Flow time: 3 seconds or less (for each side of device)

Symbol

IR35-107-2

VP15-107-2

–

Soldering process

Infrared ray reflow

VPS

Partial heating method

UPD784021 Datasheet(PDF) 82 Page - NEC

UPD784021 Datasheet(HTML) 82 Page - NEC

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