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AN607 Datasheet(PDF) 12 Page - Silicon Laboratories |
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AN607 Datasheet(HTML) 12 Page - Silicon Laboratories |
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12 / 41 page ![]() AN607 12 Rev. 1.7 The Si70xx filter cover is compatible with standard reflow soldering. It provides lifetime protection against dust and liquids and should not be removed after soldering. Figure 9. Do Not Remove Si70xx Protective Cover The reflow should follow JEDEC standards for lead free solder and reflow with a peak temperature of less than 260 ºC. “No clean” solder paste should be used. The use of an ultrasonic bath with alcohol for cleaning after soldering is specifically not recommended. The Si70xx sensor opening must be kept clean and free of particulates during assembly; the pre-installed white filter cover will protect the opening from particulates. Ensure the sensor opening does not come into contact with conformal coatings. Do not expose the Si70xx to volatile organic compounds or solvents. If installed, do not remove the white filter cover from the devices. The use of water-soluble flux and water rinse after soldering is permissible if done with care. The use of DI water is recommended. If the hydrophobic cover is used, a spray pressure of less than 40 PSI will prevent water entry into the cover. Without the cover, care would need to be taken to avoid particles from the water or from blow drying to contaminate the sensor area. The high-temperature soldering process will introduce a recoverable shift in the sensor indication. Generally, accuracy will be back within tolerance limits within 48 hours of soldering if the sensor is stored in normal ambient conditions with ~50%RH. 4.4. Sensor Sensitivity to Chemicals and Vapors The Si70xx is sensitive to many chemicals and fumes. Notably, household cleaning agents, such as ammonia, are known to cause sensor readings to drift. To maintain accuracy of the SI70xx, avoid exposure to chemical fumes and contaminants. Inert dust (e.g., talc) is essentially benign. Excessive amounts of dust can slow response. Contaminants or particles embedded in the polyimide can affect the RH accuracy. Certain polyethylene bags will outgas and damage the sensor. Bleach, hydrogen peroxide, ammonia, and other chemicals can affect or damage the sensor. 4.5. Recovering Calibration after High Humidity or Chemical Exposure Typically, initial accuracy can be recovered by baking the sensor at 125 °C for 12 hours followed by ~2 days storage period in normal ambient conditions with ~50%RH. High RH exposure (i.e., 75% RH for 12 hours) will accelerate the post-bake recovery, but, after high RH exposure, approximately two days at normal RH is still recommended for the device to fully recover its accuracy. Do not remove protective filter |
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